ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has secured its first order from a global integrated device manufacturer (IDM) based in China.

ACM Research announced on the 23rd that it has received two orders for ACM's 'Ultra C' model wet stripping system from a Chinese IDM company.

The IDM plans to use this equipment for photoresist (PR) stripping in WLPs. ACM completed the first delivery in October 2021, and delivery of the second order is scheduled for the first quarter of 2022.

“ACM Research offers a full lineup of wet process tools for WLP applications, from coaters, developers, etchers, photoresist strippers, to copper plating equipment,” said David Wang, President and CEO of ACM Research. “ACM’s WLP equipment has been widely recognized by China-based manufacturers so far, but this is the first time we have received an order for WLP wet equipment from a major global IDM,” he said.

He also expressed his ambition, saying, “This will be an opportunity to reevaluate ACM Research’s technological capabilities and production scale in the market. We are pleased that this development was made possible through the dedicated contributions of ACM Research’s team of wet process technology experts, and we look forward to expanding opportunities for additional global customers for our WLP products in the future.”

ACM Research's Ultra C photoresist wet stripping equipment is designed to increase efficiency, precision control, safety, and throughput in WLP processes.

This equipment can be combined with single wafer processing and wet bath immersion to maximize efficiency.

Although this equipment can be used alone, it is even more effective when used in conjunction with ACM's SAPS™ megasonic cleaning equipment to remove thick, difficult-to-remove photoresist coatings.