Combination of UV-based processes on a single platform
Available for use in advanced R&D and production processes

A cutting-edge solution has emerged to meet the needs of users seeking to mass-produce nano and micro optical components and devices with high degrees of freedom and precision.

EV Group (hereinafter EVG) launches the EVG®7300, an automated SmartNIL® nanoimprint and wafer-level optical system.

EVG is a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology, and semiconductor manufacturing.

EVG's latest solution, the EVG7300, is characterized by combining multiple UV-based processes, such as nanoimprint lithography (NIL), lens molding, and lens stacking (UV bonding), onto a single platform.

This industrial multifunctional system can be used in both advanced R&D and production processes for a wide range of new applications, including micro and nano patterning as well as functional layer stacking.

Examples of such applications include wafer-level optics (WLO), optical sensors and projectors, automotive lighting, waveguides for augmented reality (AR) headsets, biomedical equipment, meta-lenses and meta-surfaces, and optoelectronic devices.

The EVG7300 supports wafers up to 300mm and features high-precision alignment, enhanced process control, and excellent throughput performance.
It also meets the needs of users who wish to mass-produce nano and micro optical components and devices with various degrees of freedom and high precision.

The EVG7300 can be used as a standalone tool or integrated as a module into EVG’s HERCULES® UV-NIL track solution.

EVG’s HERCULES® UV-NIL track solution can add pretreatment or posttreatment processes, such as cleaning, resist coating, and baking, depending on the user’s specific process requirements.

The EVG7300 also provides alignment accuracy (up to 300nm).

This is thanks to a combination of various methods, including an improved alignment stage, a high-precision optical system, multipoint gap control, non-contact gap measurement, and multipoint force control.

In addition, the EVG7300 is a highly flexible platform that supports three process modes (lens molding, lens stacking, and SmartNIL nanoimprint) and wafer sizes ranging from 150mm to 300mm.

The EVG7300 provides a highly efficient platform that meets the manufacturing requirements of the industry's emerging WLO products with rapid stamping and wafer loading, high-speed alignment optics, high-power curing, and a miniaturized tool footprint.

EVG is currently accepting orders for the system and is demonstrating the product at the NILPhotonics® Competency Center located at its headquarters.

Thomas Glinsner, Director of Technology at EV Group, stated, “The EVG7300, our latest nanoimprint solution, combines lens molding and lens stacking with EVG’s proprietary SmartNIL full-field imprint technology on a single platform,” adding, “It provides the flexibility to enable customers to use it in both R&D and mass production processes.”