Seoul, August 12, 2013 — STMicroelectronics (ST), a global semiconductor company providing a wide range of electronic applications, the world's No. 1 manufacturer of MEMS (Micro-Electro-Mechanical Systems), and a leading supplier of MEMS sensors for portable consumer applications, has announced a new patented technology. This technology involves a fully molded package (a package that completely fills the empty space inside a conventional pressure sensor) and internally isolating the pressure sensing element, which will support more creative designs in next-generation mobile consumer devices and meet ultra-small form factor requirements.

Using this technology, the internal voids of the internally separated pressure sensing elements are filled and completely packaged.
Wire bonding can be performed without corrosion, preventing damage to the wire bonds during assembly. Additionally, the cap does not detach or get damaged when mounting the device, and soldering does not affect the sensor at all, allowing for a more robust package solution.

According to market analysis firm Yole Development, the MEMS pressure sensor market is projected to grow from $1.9 billion in 2012 to $3 billion in 2018. Shipments of MEMS pressure sensors for consumer applications, particularly smartphones and tablets, are expected to reach 1.7 billion units. With an additional 8% compound annual growth rate, the global MEMS pressure sensor market is expected to surpass automotive applications, which are the primary application for MEMS. ST is the world's leading MEMS manufacturer, holding over 800 MEMS-related patents and patent applications worldwide. With a daily production capacity of over 4 million units, ST has shipped more than 3 billion MEMS devices to date.

Benedetto Vigna, Senior Vice President and General Manager of the Analog, MEMS and Sensors Group at ST, said, “This technology signifies an innovative enhancement in the performance and quality of pressure sensors. ST pioneered the use of gel-free, fully molded packages in the mass manufacturing of accelerometers and gyroscopes.” He added, “ST is now leveraging this knowledge to drive innovation by applying gel-free, fully molded packages to pressure sensors for the first time. This will enable high-performance pressure sensors with enhanced accuracy.”

This latest technology further improves accuracy while continuing to provide zero drift, low noise (0.010 mbar RMS), accuracy (± 0.2 mbar), and a simplified calibration system. Therefore, it is ideal for a wide range of consumer, automotive, and industrial applications, including indoor and outdoor navigation, location-based services, GPS dead reckoning, altitude and barometric pressure sensor functions, weather measurement equipment, and healthcare applications.