Xilinx Korea (General Manager An Heung-sik) October 21, 2013 – Xilinx and TSMC announced the production of the Virtex®-7 HT product family, the industry's first heterogeneous 3D IC. Through this groundbreaking production achievement, all of Xilinx's 28nm 3D IC product families have entered production. These 28nm devices were developed using TSMC's CoWoS (Chip-on-Wafer-on-Substrate)™ 3D IC manufacturing process. This process integrates multiple components in a single device, offering significant advantages in silicon scaling, power, and performance. The achievements at 28nm enable Xilinx to succeed with TSMC's proven 20SoC and 16FinFET processes, allowing Xilinx to maintain its leadership position in all-programmable 3D ICs.

Victor Peng, Product Group Manager and Senior Vice President of Xilinx, stated, "Our CoWoS production collaboration with TSMC solidifies Xilinx's position as a pioneer and industry leader in 3D IC technology and products." He added, "Through this collaboration, Xilinx has developed groundbreaking next-generation CoWoS-based 3D ICs by leveraging our refined processes and technologies. Now we can expand our industry leadership further by utilizing TSMC's 20SoC and 16nm FinFET processes with Xilinx's UltraScale™ architecture."

Dr. Jack Sun, Vice President of R&D and Senior Technology Officer at TSMC, stated, "TSMC continues to drive Moore's Law and system integration with our latest turnkey CoWoS 3D IC manufacturing process." He added, "TSMC has achieved these results through extensive collaboration with Xilinx, and we anticipate that by continuing this partnership, we can achieve additional manufacturing and product innovations within the coming years."

Xilinx has been utilizing TSMC's advanced CoWoS process technology to produce world-class, high-capacity, high-bandwidth programmable logic devices targeting applications including next-generation wireline communications, high-performance computing, medical imaging, ASIC prototyping, and emulation.

Xilinx's Virtex-7 HT FPGA is the world's first heterogeneous all-programmable device, featuring sixteen 28Gbps transceivers and seventy-two 13.1Gbps transceivers, and is the only single-package solution for high-bandwidth, high-speed Nx100G and 400G line card applications in optical transport networks.

Along with the Virtex-7 HT FPGA, two other homogeneous devices in the 3D IC product family began production in early 2013. The Virtex-7 2000T FPGA provides 20 million ASIC gates, making it an excellent candidate for system integration, ASIC replacement, ASIC prototyping, and emulation. The Virtex-7 X1140T offers unparalleled integrated performance levels in ultra-high-performance wireline communications applications, providing ninety-six 13.1Gbps 10GBASE-KR compliant transceivers.