Texas Instruments (TI) has broken ground on a $30 billion 300mm wafer factory in Sherman, Texas. It is expected that this plant will strengthen the company's own manufacturing capabilities in the future.

TI announced on the 19th that it held a groundbreaking ceremony for a new 300mm semiconductor wafer manufacturing plant being built in Sherman, Texas.

At a groundbreaking ceremony attended by senior officials and local dignitaries, Texas Instruments Chairman, President and CEO Rich Templeton celebrated the launch of what he called the largest private sector investment in Texas history and reiterated the company's commitment to strengthening its own manufacturing capabilities over the long term.

“Today’s groundbreaking for our new plant marks a significant milestone, laying the foundation for the future growth of semiconductors to meet our customers’ needs for decades to come,” said Chairman Templeton, who attended the groundbreaking ceremony. “Since our founding 90 years ago, TI has grown with a passion for making the world a better place by creating more affordable electronics through semiconductors. “The state-of-the-art 300mm semiconductor fab we are building in Sherman is part of this effort,” he said.

The investment, which has a potential investment value of up to $30 billion, includes plans to build four fabs to meet the demands of the future semiconductor market and is expected to create up to 3,000 direct jobs.

The new fab will produce tens of millions of analog and embedded processing chips daily for use in a wide range of electronic products.

“Today’s groundbreaking ceremony marks the beginning of a new era in semiconductor manufacturing that will create tremendous economic opportunity and enhance our quality of life for our region,” said Sherman Mayor David Fryler. “We appreciate TI’s long-term and sustained investment in Sherman, and we look forward to continuing our partnership.”

TI has long been committed to responsible, sustainable manufacturing. The new fab will be designed to meet the highest level of structural efficiency and sustainability indicators of the Leadership in Energy and Environmental Design (LEED) Gold rating, a building certification system.

The Sherman fab's advanced 300mm equipment and processes will help reduce waste, water use and energy consumption.

TI's first fab, built in Sherman, is expected to be operational in 2025. The new fabs will complement TI's existing 300mm semiconductor fabs, including DMOS6 in Dallas, Texas; RFAB1 in Richardson, Texas; and another fab, RFAB2, also in Richardson, which is nearing completion and will begin production later this year.

Additionally, LFAB, located in Lehi, Utah, is expected to begin production in the first half of 2023.

“Investments to strengthen our long-term manufacturing capabilities will further solidify TI’s price competitiveness and enhance our supply chain management capabilities,” Templeton said.