Nepes introduces next-generation packaging solutions at the Electronic Components Technology Society, laying the groundwork for new business development and market expansion.

Nepes participated in the '2022 ECTC (Electronic Components and Technology Conference)' held in San Diego, USA from May 31 to June 3.

At this event, Nepes is showcasing the world's first mass-produced nPLP solution. nPLP is a technology that is a step further advanced from existing 300 mm circular fan-out wafer-level packaging (FOWLP), and is a next-generation packaging solution that implements fan-out packaging on a large square panel of 600 × 600 mm size.

On the 3rd, the last day of the event, Kang In-soo, Head of the Future Technology Planning Division, will give a presentation on the topic of 'FO-AiP-based Antenna-in-Package (FO-AiP) for 5G mmWave Applications'.

On this day, Head of Division Kang In-soo plans to introduce antenna-in-package technology that can reduce signal loss in 5G smartphone communication antennas by utilizing Nepes' unique differentiated technology, fan-out technology.

ECTC, marking its 72nd edition this year, is an international event hosted by the Electronics Packaging Society under the IEEE, where experts in electronic components and materials, packaging, and IoT attend to share future technology visions and discuss cooperation strategies.

This year, about 106 companies from 24 countries, including Nepes, Samsung Electronics, TSMC, and Amkor Technology, are participating.

"Head of Division Kang In-soo said, 'We plan to promote Nepes' differentiated PLP and 5G AiP technologies at ECTC, an international academic conference attended by the largest number of semiconductor packaging experts and potential customers from around the world, and create a foundation to continue discussions on new business development with Global Top-Tier potential customers participating in the conference.'"