ST SiC MOSFET, Semikron DPD Assembly Plant Integration

STMicroelectronics (hereinafter ST) has secured an initial order worth 1 billion euros for Semikron's new eMPack® power module family based on long-term engineering and component supply cooperation.

ST announced on the 15th that Semikron has adopted ST's SiC technology for its eMPack® power module for electric vehicles.

This is the result of four years of technological cooperation between the two companies, aimed at providing efficiency and industry benchmark performance in smaller systems by applying ST's advanced SiC power semiconductors to the design.

SiC is rapidly emerging as a power technology that supports electric vehicle traction drives preferred by the automotive industry, contributing to increased driving range and reliability.

Semikron recently announced that it has signed a 1 billion euro contract with a major German automaker to supply innovative eMPack power modules starting in 2025.

Engineers from ST and Semikron collaborated to integrate advanced STPOWER SiC MOSFETs, which control power switching in the main traction inverters of electric vehicles, into Semikron's innovative fully sintered Direct Pressed Die (DPD) assembly process.

DPD improves module performance and reliability, and enables cost-effective power and voltage scaling.C. Semikron has built 750V and 1,200V eMPack platforms utilizing ST’s SiC MOSFET parameters provided as bare dies, supporting applications from 100kW to 750kW and battery systems from 400V to 800V.

Karl-Heinz Gaubatz, CEO and CTO of Semikron, stated, “ST’s SiC device manufacturing capabilities and technical expertise enabled us to integrate cutting-edge semiconductors into Semikron’s advanced manufacturing processes. As we transition to mass production, we are building a stable supply chain through our collaboration with ST that allows us to control quality and delivery performance.”

Edoardo Merli, Senior Vice President and Head of the Power Transistor Subgroup at ST, explained, “Semikron’s scalable, advanced eMPack power module family, utilizing ST’s SiC technology, will contribute significantly to zero-emission in automobiles. ST’s current third-generation SiC technology supports innovation in electric mobility and is driving improvements in efficiency, performance, and reliability for sustainable energy and industrial power control applications.”