Congatec enters the high-performance industrial workstation and desktop client markets with the launch of a highly scalable, modular, high-performance Micro-ATX COM-HPC carrier board.

Congatec Korea announced on the 2nd that it is launching its first modular Micro ATX carrier board equipped with a COM-HPC interface.

This processor socket and vendor-agnostic board can be mounted on all high-performance computer-on-modules of COM-HPC client sizes A, B, and C, making OEM designs more flexible and sustainable.

Congatec's 12th Gen Intel Core processor-based COM-HPC modules support excellent scalability across all products and provide 14 top-tier performance levels.

Performance options for the latest conga-HPC/uATX carrier board family range from the conga-HPC/cALS COM-HPC client size C module, equipped with a 16-core Intel Core i9 processor and providing the best embedded client performance currently available, to the conga-HPC/cALP COM-HPC client size A module, equipped with an Intel Celeron 7305E processor and offering excellent value for money.

'Application-Ready' industrial COM and carrier boards and custom cooling solutions, comprehensive BSPs for all Real-Time Operating Systems (RTOS) and Real-Combining with Time Systems' real-time hypervisor enables rapid time-to-market and minimizes the effort required to enhance the performance of Micro ATX-based systems by lowering engineering costs to the lowest possible level without repetition.

This product supports customers in creating a diverse and complete product portfolio based on a single carrier concept.

Upgrade and update options for Micro ATX-based platforms are built into the design, providing flexible, high-performance network and system design security and sustainable long-term availability for application-specific custom carrier boards and system designs.

The option to select available COM-HPC modules during a time of supply chain uncertainty is a differentiating feature of the newly released carrier board.

OEMs do not rely on specific BGA or LGA processors provided by a single semiconductor or computer-on-module vendor, significantly reducing the risk of supply shortages.

Furthermore, machine and application-specific peripherals remain intact without the need for hardware changes.

“The industrial COM-HPC carrier board in the Micro ATX form factor delivers all the advantages of Computer-on-Module to the premium industrial and semi-industrial motherboard markets,” said Martin Danzer, Head of Product Management at Congatec. “This product evolves existing motherboard-based system designs tailored to specific processor generations into motherboard layouts that utilize Computer-on-Module, offering significantly greater flexibility and continuous scalability. To lower NRE costs and maximize the return on investment for dedicated systems, the lifecycle of industrial applications must be longer than 3 to 5 years.” "The ability to switch processor performance to future options without the need to rebuild the entire system is a huge advantage for various industries," he said.