Shin Joo-yong, Director of TI Korea


Achieving the highest power density ever in a reduced system footprint
Upgraded system thermal management and increased system robustness.

As power consumption of electronic devices increases, Texas Instruments Korea (TI) is aggressively targeting the power management product market with new products featuring high power density and efficiency.

On the 21st, TI held a press conference at the COEX Intercontinental Hotel and introduced TI's thermal management technology and new power management products based on it.

TI Director Shin Ju-yong spoke about the industry trend of demanding more power in smaller spaces and the importance of thermal management to increase power density.

To address these trends and their importance, TI has outlined three directions in which it is innovating to maximize power density, drawing on the latest product examples that help engineers address thermal challenges.

According to Director Shin Joo-yong, power consumption is increasing across all electronic devices, from consumer devices to data center server power supplies and satellites.

With increasing power consumption, improved efficiency and more power supply are required in smaller spaces.

In particular, data centers and servers require high power density in server power architectures because they need to supply more power in a limited space, while at the same time reducing cooling costs through high efficiency of server power supply.should be reduced.

In this regard, Director Shin Joo-yong expressed confidence that the company's new product will enable it to achieve previously unattainable levels of power density in a reduced system space, maintain system costs, while upgrading system thermal management capabilities and increasing system robustness.

TI, with its long-accumulated expertise in power management technology and related solution research and development, helps engineers design electronic devices that generate less heat and improve heat dissipation through process technology, circuit architecture, and packaging innovation.

The first power management device introduced is the TPS566242, a synchronous buck converter that provides high power density.

This is the industry's smallest 6A ECO mode synchronous buck converter, and it achieves excellent thermal performance by applying advanced process technology nodes.

Suitable for wide-area monitoring, data centers, and distributed power systems, the TPS566242 supports input voltages from 3V to 16V and up to 6A continuous current and measures 1.6mm x 1.6mm.

The new process technology node improves PCB heat dissipation by optimizing pin layout, integrating multiple functions, and providing additional grounding wiring.

The second product is the TPS25985, which provides the industry's highest peak current and is the first eFuse to include active current sharing.

This achieves robust protection for enterprise and telecommunication system designs exceeding 300A and also achieves higher efficiency at the process technology level.

The TPS25985 eFuse combines accurate and fast current sensing with a novel active current sharing approach, enabling high current sharing and accurate current monitoring with temperature management.

Also, the efficient switch is a creative integrated approach.By combining them in a compact package, peak currents up to 80A can be provided, and multiple eFuses can be stacked to provide higher power.

The last new product introduced is the LMG3522R030-Q1, the industry's first top-cooled GaN FET with integrated gate driver.

GaN devices with top-side cooling are an effective solution for removing heat from ICs and reducing PCB heat generation in high-power applications such as server PSUs.

The LMG3522R030-Q1 offers excellent thermal performance and overtemperature and undervoltage lockout protection, making it suitable for 2-5kW power supplies in servers, data centers, telecommunications equipment, and industrial applications.

“Achieving superior device performance and figure of merit requires investing in innovative semiconductor technologies,” said Jeffrey Moroney, director of power management R&D at TI’s Jack Kilby Labs, regarding this product launch. “TI has invested in power and gallium nitride (GaN) research for more than a decade and has developed solutions for high-voltage switching to achieve optimal performance.”