congatec Korea, a leading company in embedded and edge computing technologies, is launching a new product line of computer-on-module-based modules based on the Com Express 3.1 specification, providing developers with the highest level of design security.

Congatec Korea announced on the 30th that it has released 10 computer-on-modules based on the 12th generation Intel Core processor (codenamed Alder Lake) following standard approval of the Com Express 3.1 specification.

This module is equipped with a newly updated 16Gbps COM Express connector, supporting ultra-fast interface technologies such as PCIe 4.0 and USB 3.2.

This latest module, which is an upgrade to the existing COM Express Type 6 module family and conforms to the COM Express 3.1 standard, offers up to 14 cores and 20 threads, allowing customers to offer products that meet official certification specifications while offering significantly improved performance.

In this way, congatec provides its customers with the highest level of design security and ensures that existing comb express designs will maintain high performance and reliability for a long time to come.

“The release of the Com Express 3.1 specification is a major step forward in our future-proofing, enabling us to continue leveraging a standard that has been established in the market for over 18 years,” says Christian Eder, Product Marketing Director at congatec."All existing high-performance embedded designs based on the Ter-on module can be upgraded to the latest standards. Ensuring the sustainability of existing COM Express-compliant carrier board design investments is one of PICMG's most important achievements," he said.

Additionally, PCIe 4.0 and the latest COM Express 3.1 specifications support advanced features not previously supported, such as USB 4, MIPI-CSI connectors, information on signal integrity and loss budgets for SATA Gen 3, and SoundWire.

Despite all these improvements, Type 6 modules with the COM Express 3.1 specification are fully backward compatible with 3.0 modules and carrier boards, allowing older designs to be equipped with the latest processor technology.

Further information about the conga-TC670 Computer-on-Module with the latest Com Express 3.1 specification can be found on the congatec website, while information about the Com Express 3.1 specification and purchasing the product can be found on the PICMG website.