Texas Instruments (TI) is significantly increasing production of advanced analog and embedded chips through the full-scale operation of its second 300mm fab.

TI announced on the 22nd that LFAB, TI's second 300mm fab located in Lehi, Utah, has begun initial production.

TI started production approximately one year after acquiring LFAB.

LFAB features a cleanroom exceeding approximately 275,000 square feet and is equipped with 11 kilometers of overhead tracks to ensure smooth wafer movement.

Supporting 65nm and 45nm technology, it can produce tens of millions of analog and embedded processing chips daily, which are used in electronic products everywhere.

Additionally, advanced equipment and facility upgrades have reduced waste, water, and energy consumption.

TI plans to invest a total of $3 to $4 billion in this facility. The company also invested over $600,000 in the Utah community in 2022, contributing to the local community.

Kyle Flessner, Senior Vice President of TI's Technology and Manufacturing Group, stated, "We are pleased to be expanding our manufacturing processes to provide the manufacturing capacity our customers will need over the next several decades. This achievement is part of our long-term investment in capabilities, and will further solidify TI's efforts to expand internal manufacturing capacity to support continued growth in semiconductors used in electronic products."