February 10, 2014, Seoul – STMicroelectronics (ST), a global semiconductor company contributing to customers across a wide range of electronic applications, has unveiled two new power packages, the PowerFLAT™ 5x6 HV and PowerFLAT™ 5x6 VHV, which make energy-related equipment such as battery chargers, solar microinverters, and computer power supplies smaller, stronger, and more reliable. With this, ST adds three products to each of its advanced high-voltage power MOSFET families.

These two new power packages provide the large isolation paths and space required for operation up to 650V or 800V within the same 5 x 6mm footprint as the standard 100V PowerFLAT (PowerFLAT 5x6). This is 52% smaller than the footprint of the widely used DPAK, and features a package height of only 1mm and a wide Metal Drain Pad to maximize heat dissipation from PC board thermal biases.

The combination of these features simultaneously increases high voltage capacity, robustness, reliability, and system power density.

ST has unveiled three 650V MDmesh™ V MOSFETs in the PowerFLAT5x6 HV package. Among them, the STL12N65M5 is priced starting in the $2.20 range. Four 800V SuperMESH 5 MOSFETs in the PowerFLAT5x6 VHV package are optimized for ultra-high voltage applications. Among these, the STL2N80K5 product is priced starting from the $1.50 range. All prices apply to orders of 1,000 units or more.

In addition, ST has started sampling two types of the new 600V high-speed switching MDmesh II Plus low Qg MOSFET for 'PowerFLAT 5x6 HV'.