congatec Korea, a leading company in embedded and edge computing technologies, has launched a computer-on-module equipped with the 13th generation Intel Core processor, providing an opportunity to upgrade existing high-end embedded and edge computing solutions.

congatec announced on the 4th that it has launched COM-HPC and COM Express computer-on-modules based on the 13th generation Intel Core processors that boast high-performance with BGA sockets.

This latest processor, with its long product life cycle, offers a variety of enhanced features and is fully backwards compatible with previous generation hardware, enabling quick and easy implementation.

Congatec anticipates a rapid increase in the production speed and volume of OEM designs based on the newly launched modules.

Modules based on the new COM-HPC standard, with Thunderbolt support up to Gen 5 and enhanced PCIe, open up new realms for developers in terms of data throughput, I/O bandwidth, and performance density.

Compatible modules with the COM Express 3.1 specification help protect investments in existing OEM designs, including upgrade options for higher data throughput with PCIe Gen 4 support.

The new COM-HPC and COM Express computer-on-modules featuring the 13th generation Intel Core processors with soldering are compatible with the 12th generation Intel It boasts 8% improved single-thread performance and 5% improved multi-thread performance compared to modules equipped with core processors.

These performance gains (15-45W reference power) are closely related to significantly improved power efficiency due to manufacturing process improvements, while DDR5 memory support and PCIe Gen 5 connectivity on select SKUs further enhance multi-threaded performance and data throughput.

The Intel Iris Xe integrated graphics architecture, offering up to 80 execution units (EUs) and ultra-fast encode and decode, is ideal for meeting the intense graphics demands of video streaming and video data-driven contextual awareness applications.

These capabilities are effective in improving a wide range of applications, including industrial, medical, AI, and machine learning, as well as all types of embedded and edge computing where workload consolidation is implemented.

“The 13th Gen Intel Core processors have contributed to the outstanding implementation of the next generation of Computer-on-Modules,” says Jurgen Jungbauer, Senior Product Manager at congatec. “This module provides the industry with the opportunity to rapidly upgrade existing high-end embedded and edge computing solutions, and this launch will be of great importance to all congatec OEM customers and Value Added Resellers (VARs),” he said.

The new conga-HPC/cRLP Computer-on-Modules (size A form factor) and the compact conga-TC675 modules with the latest Com Express 3.1 specification are available as follows:

Application engineers can deploy the latest COM-HPC Computer-on-Modules on congatec's Micro ATX standard carrier boards for COM-HPC client type modules, enabling them to immediately take advantage of all the benefits and improvements of the latest modules, including ultra-fast PCIe Gen 5 connectivity.

More information about the latest Computer-on-Modules in the COM-HPC Size A and COM Express 3.1 form factor standards, custom cooling solutions, and congatec's migration services can be found on the congatec website.

Further information about the latest conga-HPC/cRLP Computer-on-Modules in the COM-HPC standard and the conga-TC675 Computer-on-Modules in the COM Express Compact Type 6 standard can be found on the congatec homepage.