Improved power density and ease of assembly compared to existing TO-style packages
Suitable for electric vehicle OBC, DC/DC converter, and industrial power conversion

STMicroelectronics (ST) has launched the STPOWER automotive-grade device in a surface-mount ACEPACK SMIT package with cooling support.

STMicroelectronics (NYSE: STI) today announced the launch of five power semiconductor bridges in a general configuration based on its advanced ACEPACK™ SMIT package, which improves power density and eases assembly compared to conventional TO-style packages.

Engineers can choose from two STPOWER 650V MOSFET half-bridges, a 600V ultra-fast diode bridge, a 1200V half-controlled full-wave rectifier, and a 1200V thyristor-controlled bridge leg.

All devices meet automotive industry requirements and are also suitable for electric vehicle on-board chargers (OBCs), DC/DC converters, and industrial power conversion.

ST's ACEPACK SMIT surface-mount package offers a thermally efficient and easy-handling insulated package with an exposed drain.

This enables DBC (Direct-Bonded Copper) die attachment, supporting efficient top-side cooling.br />
ACEPACK SMIT has 4.6cm2 of exposed top metal, allowing for easy attachment of flat heatsinks.

This enables space-saving, low-profile configurations, maximizes heat dissipation for high reliability at high power, and allows modules and heatsinks to be placed using automated inline equipment, reducing manual processes and increasing productivity.

The 32.7mm x 22.5mm package footprint with top-side cooling design provides only 6.6mm of creepage distance between leads, enabling high power density with minimal stack height.

Tab-to-lead isolation is 4,500 Vrms. This package also features low parasitic inductance and capacitance.

The SH68N65DM6AG and SH32N65DM6AG 650V-MDmesh DM6 MOSFET half-bridges, currently available in ACEPACK SMIT packages, are AQG-324 qualified.

High electrical efficiency and low heat dissipation are ensured with a maximum Rds(on) of 41 mΩ for SH68N65DM6AG and 97 mΩ for SH32N65DM6AG.

These devices can be used in both OBC and high-voltage-low-voltage DC/DC converters. It also simplifies inventory and procurement through multi-functional flexibility.

The STTH60RQ06-M2Y, a 600V, 60A full-wave bridge rectifier, consists of ultra-fast diodes with soft recovery characteristics and supports PPAP for automotive applications.

The STTD6050H-12M2Y, a 1,200V, 60A half-regulated single-phase AC/DC bridge rectifier, is AEC-Q101 qualified and features excellent noise immunity with a dV/dt of 1,000V/μs.

The STTN6050H-12M1Y is a 1,200V, 60A half-bridge consisting of two internally connected thyristors (silicon-controlled rectifiers - SCRs).

Qualified to AEC-Q101, the device can be used in industrial applications such as AC/DC conversion in motor drives and power supplies, single-phase and three-phase controlled rectifier bridges, totem-pole power factor correction (PFC), and solid-state relays, as well as automotive on-board control circuits (OBCs) and charging stations.