February 12, 2014 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced the development of the EVG150XT (HVM), the most advanced 300mm photoresist processing system currently required for logic and memory mass production. Utilizing EVG’s XT frame platform, the EVG150XT is optimized for very high throughput and productivity, making it available for use across leading and diverse processes. By combining the company’s expertise in lithography processes, EVG has introduced a system suitable for mass production. EVG150XT can be used in a variety of applications, including general PR coating processes, dielectric film coating processes, high-thickness PR coating processes used in MEOL (mid-end-of-line), silicon piercing technology (TSV) used in BEOL (back-end-of-line) semiconductor processes, wafer bumping, redistribution layers, and manufacturing processes for interposer packages of 2.5 and 3D-ICs.

2.5/3D packaging is becoming increasingly feasible across the semiconductor industry and can be applied to a wide range of mobile devices and other consumer electronics as it allows for the stacking of chips with various functions in a smaller area. New manufacturing processes and cost reduction requirements are being demanded across the wafer manufacturing process, particularly in the MEOL and BEOL processes. In the future, as device fabrication requires increasingly smaller chip spacing and manufacturing processes such as copper pillars, and as the application of under-bump metal technology enables chip-to-chip connections, the formation of redistribution layers and the connection of devices with heterogeneous designs will require uniform and strict standards in the semiconductor manufacturing process. As mass production methods for stacked devices are required across the industry, all wafer processing equipment used to manufacture these devices will require enhanced throughput and processing capabilities.

The EVG150XT provides nine process modules that can be mounted simultaneously for multiple parallel wafer processing. Optimized software optimizes process throughput and intelligently controls the processing order, and the optimal pump and dispense system is designed to be suitable for processing high-thickness films.
In addition, an in-line metrology module has been integrated into the EVG150XT to enable real-time process optimization and detect types of process defects in order to reduce defect yield and production costs. These enhanced software and hardware capabilities allow the EVG150XT to be optimized for use in mass production environments.

Paul Lindner, Senior Technical Director at EV Group, stated, “Over the past 30 years, EVG has worked closely with customers regarding mass production lithography equipment and has secured effective process know-how to improve performance by incorporating customer requests into the development of next-generation products. Looking at EVG’s latest product, the EVG150XT, EVG has successfully combined two areas of expertise by introducing the industry’s first mass production lithography process to best meet customer requirements for MEOL/BEOL lithography process technology.”