Congatec, a leading company in embedded and edge computing technology, has unveiled the COM-HPC Mini module in Germany, opening new horizons in the design of ultra-small systems.

Congatec announced that it will participate in 'Embedded World 2023', held in Nuremberg, Germany from March 14 to 16 (Hall 3, Booth No. 241), to showcase its COM-HPC ecosystem.

At this exhibition, Congatec unveils an expanded portfolio ranging from high-performance COM-HPC server-on-modules to credit card-sized, ultra-compact, state-of-the-art COM-HPC client-on-modules.

Congatec supports everything designers need for next-generation high-performance embedded and edge computing platforms, along with custom cooling solutions, carrier boards, and design implementation services.

This exhibition showcases the first design sample of the COM-HPC Mini standard, which enhances the performance of space-constrained solutions and allows for greater utilization of new high-speed interfaces.

This enables the migration of the entire product family to the latest PICMG standard without significant changes to the internal system design and housing.

The first high-performance COM-HPC Mini module, officially launched following PICMG's final approval of the new specifications, is equipped with 13th Gen Intel Core processors (codename Raptor Lake) for high-performance embedded and edge applications for customers You can benchmark computing.

With the recently released COM-HPC Client Size A and C type high-performance computer-on-modules equipped with 13th generation Intel Core processors, developers can utilize the latest generation processors of all bandwidths in COM-HPC.

The COM-HPC standard has opened new horizons for developers by enabling innovative designs with cutting-edge connectivity in terms of data throughput, I/O bandwidth, and performance density that were not achievable with the existing COM Express.

In addition, Congatec COM Express 3.1 models equipped with 13th generation Core processors primarily support the return on investment for existing OEM product designs and support PCIe Gen4, providing upgrade options to increase data throughput.

Further information about the COM-HPC and COM-HPC Mini form factors can be found on the Congatec website.