CEVA Seeks Improved Power Efficiency and Performance by Enhancing CEVA-TeakLite-4 DSP Architecture
Published2014.03.10 12:00On March 10, 2014, CEVA, a leading licensing company for Silicon Intellectual Property (SIP) platform solutions and DSP cores, announced the release of the CEVA-TeakLite-4 v2 DSP architecture, which enables groundbreaking performance improvements and reduced power consumption for digital signal processors (DSPs) for audio and voice applications.
The architectural enhancements in CEVA-TeakLite-4 v2 include an Instruction Set Architecture (ISA) with new power optimization features and a Power Scaling Unit (PSU) capable of reducing power consumption by up to 20%. The latest architecture enables a reduction in die size and overall system cost by shrinking the code size of major audio and voice codecs by up to 30%.
In addition, 50 new instructions, enhanced 64-bit data processing support, 128-bit scalable data bandwidth, master-slave device placement flexibility, and a robust system interface spanning from low-power AHB buses to high-performance AXI buses are added. The architectural framework of CEVA-TeakLite-4 v2 is built on a family of four DSP cores consisting of CEVA-TL410, CEVA-TL411, CEVA-TL420, and CEVA-TL421.
“To date, over 3 billion audio and voice devices using CEVA have been shipped, and the CEVA-TeakLite DSP product family has been recognized as an industry leader for over 10 years. “CEVA-TeakLite-4 has inherited the reputation of this DSP line and has been adopted in more than 10 products, receiving outstanding evaluations, particularly in Power, Performance and Area (PPA),” he emphasized. “The newly unveiled CEVA-TeakLite-4 v2 architecture enhancements provide even better PPA optimization and performance for audio and voice applications, enabling related developers to implement audio and voice products that are differentiated from other products.”
As companies adopt new value-added features such as 'Always-on' contextual awareness, Active Noise Cancellation (ANC), and Super Wideband Voice to enhance user experience and differentiate products, the demand for advanced audio and voice capabilities in the mobile, consumer electronics, and automotive markets is continuously surging.
Through the newly announced CEVA-TeakLite-4 v2 DSP architecture, CEVA supports high-performance home entertainment and HD audio applications by providing intensive use cases for DSP processing with enhanced precision and efficiency.
CEVA enables audio-related tasks to be easily performed on the CEVA-TeakLite-4 v2 DSP instead of the CPU through its proprietary framework AMF (Android Multimedia Framework) to support the integration of the CEVA-TeakLite-4 v2 DSP core system on Android devices from related developers, thereby reducing power consumption by 1/8. CEVA has already demonstrated the performance of AMF on Android-based systems at the 2014 International Consumer Electronics Show (CES 2014), held in Las Vegas, USA, from January 7 to 10.
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