Infineon Technologies AG, a global leader in automotive semiconductors, and Hon Hai Technology Group (Foxconn), the world's largest provider of electronic manufacturing services, have joined hands to develop SiC and electric vehicle technologies.

Infineon announced on the 10th that it has signed an MOU with Foxconn and will establish a long-term partnership in the electric vehicle (EV) sector to jointly develop advanced electric mobility with efficient and intelligent functions.

According to the MOU, the focus is on developing silicon carbide (SiC) for high-power automotive applications, such as traction inverters, onboard chargers, and DC-DC converters, by leveraging Infineon's automotive SiC innovation and Foxconn's automotive system know-how.

In addition, the two companies plan to further expand the scope of cooperation by establishing a system application center in Taiwan.

This center will focus on optimizing vehicle applications, including smart cabin applications, advanced driver assistance systems, and autonomous driving applications.

In addition, it will cover electric mobility applications such as battery management systems and traction inverters.

This collaboration involves sensors and microcontrollersIt encompasses Infineon's extensive range of automotive products, including power semiconductors, high-performance memory for specific applications, human-machine interfaces, and security solutions. The System Applications Center is scheduled to be established within 2023.