Launch of the First IoT-Enabled Tiva™ C Series Connected LaunchPad in the TI Ecosystem
Published2014.03.13 13:06
TI Korea (CEO Kent Tran, www.ti.com/ww/kr ) March 12, 2014 – TI (CEO Kent Tran) announced the addition of the Tiva™ C Series Connected LaunchPad to its Microcontroller (MCU) LaunchPad ecosystem.
Engineers and manufacturers can rapidly prototype a wide range of cloud-enabled applications and apply extensive connectivity to all LaunchPad-based applications using this innovative $19.99 Internet of Things (IoT) platform. The onboard Tiva C Series TM4C1294NCPDT MCU adds enhanced Ethernet technology and a maximum memory footprint to the LaunchPad ecosystem. The platform's reliable performance and diverse peripherals enable the simultaneous execution of multiple communication stacks, allowing engineers to develop network gateways capable of connecting multiple endpoints to the cloud. It can be applied to any application requiring connectivity, including sensor gateways, home automation controllers, industrial communication/control networks, and cloud-enabled products/appliances.
The Tiva C Series Connected LaunchPad features an onboard Ethernet MAC+PHY, high-level analog integration, and connectivity options, as well as two BoosterPack XL plug-in interfaces. These interfaces allow designers to connect to a wide range of compatible BoosterPacks to extend the application range to sensors, displays, wireless modules, and more.
The extensive ecosystem of BoosterPack plug-in modules enables the expansion of various applications. Developers can use BoosterPack solutions from TI and other third parties, including TI's SimpleLink™ Wi-Fi CC3000 BoosterPack and Anaren's SimpleLink Bluetooth Low Energy CC2541-based BoosterPack. The Tiva C Series Connected LaunchPad features an extensive TivaWare™ software platform containing over 50 software application examples, allowing developers to reduce development time and bring differentiated products to market more quickly.
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