Molex, a global electronics leader and connector innovator, is unveiling the industry's first chip-to-chip 224G product portfolio, accelerating support for next-generation data sensor and AI applications.

Molex today announced the launch of its industry-first chip-to-chip 224G product portfolio, including next-generation cables, backplanes, board-to-board connectors, and near-ASIC connector-to-cable solutions operating at speeds up to 224Gbps-PAM4.

This uniquely positions Molex to meet the growing demand for the fastest data rates to support advanced technologies, including generative AI, machine learning (ML), 1.6T networking, and other high-speed applications.

Achieving data rates up to 224 Gbps-PAM4 requires a completely new system architecture consisting of multiple chip-to-chip interconnects.

To achieve this, a cross-functional global team of Molex engineers collaborates closely with customers, technology leaders, and suppliers, using cutting-edge predictive analytics and advanced software simulations.

Looking at the portfolio launched by Molex this time, the Mirror Mezz genderless mezzanine board-to-board connector supports 224Gbps-PAM4 speeds while solving various height requirements, PCB space constraints, manufacturing and assembly challenges, reducing application cost and time-to-market. It shortens the time.

The 224Gbps-PAM4 Near ASIC connector-to-cable system delivers robust, reliable performance with the benefits of post-mating screw coupling, integrated strain relief, reliable mechanical wipe, and a fully protected "thumb-proof" mating interface, ensuring long-term reliability. High-performance twin X and innovative shielding construction provide excellent Tx/Rx isolation.

OSFP 1600 solutions include SMT connectors and cages, along with Direct Attach (DAC) and Active Electrical Cable (AEC) solutions engineered for aggregate speeds of 224 Gbps-PAM4 per lane or 1.6 Tbps per connector, as well as BiPass. Enhanced shielding minimizes crosstalk while enhancing signal integrity at higher Nyquist frequencies.

The QSFP 800 and QSFP-DD 1600 solutions have been upgraded to offer SMT connectors and cages, along with DAC and AEC solutions designed for aggregate speeds of 224 Gbps-PAM4 per lane or 1.6 Tbps per connector, as well as BiPass. Molex's QSFP and QSFP-DD solutions ensure mechanical robustness, improved signal integrity, reduced thermal load, design flexibility, and reduced rack costs.

Samples of Mirror Mezz Enhanced, Inception, and CX2 Dual Speed will be available this summer, while samples of Molex's new OSFP and QSFP products will be available in the fall.