Silicon Labs (CEO Baek Woon-dal) is expected to enable smarter and more efficient IoT implementations with the launch of its 22nm-based Series 3 platform, which boasts a 100x performance improvement with a new AI/ML engine.

Silicon Labs today announced its next-generation Series 3 platform designed specifically for embedded IoT devices at its fourth annual Works With Developers conference.

With the move to a 22 nanometer (nm) process node, new Silicon Labs Series 3 devices will be designed to deliver the industry’s highest level of IoT security on a SoC along with leading compute, wireless performance and energy efficiency.

Silicon Labs also announced the next version of Simplicity Studio, a suite of developer tools that help developers and device makers simplify and accelerate product design.

Supporting Silicon Labs’ entire portfolio, including Series 3, Simplicity Studio 6 enables developers to take advantage of Silicon Labs’ productivity tools while leveraging the market’s most preferred integrated development environment (IDE).

“The Series 3 platform is designed to deliver the development flexibility needed to create a more connected world and bring more intelligence to the edge,” said Matt Johnson, CEO of Silicon Labs.o;Series 3 is designed to meet the needs of developers and device manufacturers today, as well as those of the next decade,” he said.

Series 3 devices deliver enhanced security and power efficiency based on Silicon Labs’ industry-leading Secure Vault™ technology, the industry’s first PSA Level 3 certified security package.

It also increases processing performance by more than 100x by integrating system processing into the wireless SoC, including integrated AI/ML accelerators for edge devices.

It is expected to be the only multi-wireless IoT platform with a common code base for more than 30 products across a wide range of major wireless protocols, including Bluetooth LE, Wi-Fi, Wi-SUN, IEEE 802.15.4, multi-protocol and proprietary protocols, as well as other major protocols.

In particular, the transition to 22nm will provide significant scalability for Series 3. There have been several events and movements that have strained the semiconductor supply chain across the industry over the past few years, and IoT is no exception. To minimize geographic risk and customer disruption, Series 3 will be manufactured in multiple fabs across multiple regions.