ACM Research, a company specializing in wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has announced a new vacuum cleaning solution to meet the new cleaning requirements of advanced 3D packages.

ACM Research announced on the 27th that it has launched the ULTRA C v Vacuum Cleaning Tool through its operating subsidiary, ACM Research (Shanghai), Inc., to meet flux removal requirements unique to chiplets and other advanced 3D packaging structures.


The new equipment, developed in collaboration with several key customers, demonstrated excellent processing performance with no flux residue remaining after cleaning. ACM announced that it has received a purchase order for the new equipment from a major Chinese semiconductor manufacturer and plans to deliver it in the first quarter of 2024.

Interest in modular chiplet technology has grown rapidly as the semiconductor industry seeks alternative architectures capable of implementing more powerful chips without reducing transistor size. This approach combines modular chiplets to form more complex ICs, offering improved performance, reduced costs, and enhanced design flexibility compared to existing monolithic chips. Chiplets are seeing increasing adoption across the server, PC, consumer electronics, and automotive markets.

Dr. David Wang, President and CEO of ACM, stated, “Chiplets present unique challenges that are difficult to effectively address with existing cleaning technologies, which can represent a tremendous market opportunity for the semiconductor manufacturing industry. Through collaboration with several key customers, ACM has been able to resolve the technical challenges of chiplet deployment and provide differentiated equipment capable of achieving the performance and throughput required for mass production. The ULTRA C v vacuum cleaning equipment is suitable for chiplet models and allows us to further expand our product portfolio to seize opportunities in this emerging market.”

ACM’s ULTRA C v vacuum cleaning equipment addresses the unique requirement of removing flux used after reflow as part of the advanced packaging process.

As the size of these devices becomes increasingly smaller, conventional cleaning methods under atmospheric pressure are no longer sufficient to effectively remove flux.

The new equipment capable of cleaning in a vacuum has improved surface wetting ability, allowing liquid to flow into very narrow spaces, so that residual flux can be completely removed within a reasonable cleaning time.

For devices requiring a very high level of flux immersion, a saponifying agent may be added for more thorough cleaning.