Ansys Korea (CEO Seok-Hwan Moon), a global leader in engineering simulation, is contributing to the improvement of performance and reliability of Samsung Electronics foundry products by working closely on power and thermal management for advanced parallel (2.5D) and 3D integrated circuit (3D-IC) systems.

Ansys announced on the 23rd that Samsung Electronics' Foundry business unit has certified the Ansys RedHawk power integrity and thermal verification platform for Samsung's heterogeneous multi-die packaging technology product family.

Samsung is working closely with Ansys because power and thermal management are critical to the reliability and performance of advanced parallel (2.5D) and 3D integrated circuit (3D-IC) systems.

Many leading semiconductor products for high-performance computing, smartphones, networking, artificial intelligence, and graphics processing are implemented through 3D-IC technology, which enables companies to achieve competitive differentiation in the market.

Samsung offers various 2.5D packaging options (I-Cube and H-Cube) and 3D vertical stacking using X-Cube technology.

Integrating multiple chips at high density presents significant challenges in heat dissipation. A single die can consume more than 100W of power, which must be routed through very fine microbump connections.

Samsung collaborated with Ansys to certify RedHawk-SC Electrothermal to simulate temperature profiles using packaging technology.

In addition, Samsung verified the prediction accuracy of RedHawk-SC Electrothermal with Ansys' Icepak solution for the thermal analysis of electronic assemblies, including forced air cooling and heat sinks.

RedHawk-SC verifies the electromigration (EM) reliability and voltage drop (IR drop) accuracy of the entire power distribution network connecting chiplets and interposers.

"Samsung Electronics Foundry Division DT Team Senior Vice President Kim Sang-yoon stated, 'Samsung Electronics Foundry Division views heterogeneous integration as a core technology for the future of the semiconductor industry. However, it also gives rise to various new challenges and multiphysics problems that require careful analysis for the successful development of systems.'" “Ansys is a key partner that provides better performance and high reliability by offering proven simulation technology that customers can use for thermal management and power analysis,” he said.

John Lee, Vice President and General Manager of Ansys’ Electronics, Semiconductor and Optics business unit, said, “We were able to collaborate with Samsung Electronics’ foundry business unit at the chip, package, and system levels by providing Ansys’ unrivaled expertise in power management and system analysis. Through our ongoing partnership with Samsung, we maintain our leadership in silicon processing technology and support customers in making the most of Samsung’s 3D-IC technology.”