“'Hybrid Bonding' is the Trend, Particle Management is Key”
Published2024.02.26 16:32"Packaging technology is shifting from post-process to pre-process. The paradigm has changed. Accordingly, semiconductor equipment and materials companies are all preparing semiconductor packaging solutions."
Comments
Related news
[SEMICON Korea 2023] “Hybrid Bonding, Hot Interest”… Global Small Business Capabilities Focused
"Die to Wafer Hybrid Bonding (D2W bonding) has been under technical development for a long time, but scaling is just beginning now."
2023.02.08by 명세환 기자
Applied, Hybrid Bonding·TSV New Technology Launched… Heterojunction Chip PPACt Improvement
Heterogeneous Integration (HI) is an advanced solution that increases performance and density while reducing costs. As semiconductor manufacturing approaches the limits of fine-line processes, the industry is actively pursuing innovations at the packaging level. Applied's newly launched heterogeneous integration manufacturing solution improves chip PPACt (Power, Performance, Area, Cost, and Time-to-Market), contributing to the achievement of Moore's Law at the packaging stage.
2023.07.18by 명세환 기자
Securing ultra-gap source technology, supporting advanced packaging and on-silicon displays
In the Year of the Wood Dragon, support for securing next-generation foundational technologies in the three strategic fields of semiconductors, displays, and secondary batteries is expected to accelerate.
2024.01.02by 권신혁 기자
EVG Announces New NanoCleave Layer Release Technology
EV Group, a leading provider of wafer bonding and lithography equipment for MEMS, nanotechnology, and semiconductor markets, has achieved thin-film 3D stacking from advanced packaging to transistor miniaturization through EVG's innovative layer separation technology utilizing infrared (IR) lasers.
2024.02.01by 배종인 기자
Intel Launches Systems Foundry...1nm Shipments in 2025
The advanced semiconductor foundry market is prepared to expand from a two-way competition into a three-way battle. Intel has launched a full-fledged systems foundry business, revealing ambitions to establish ecosystem leadership by leveraging advanced process nodes and cutting-edge packaging technologies.
2024.02.22by 권신혁 기자
