Congatec, a leader in embedded and edge computing technology, introduces an application-ready ecosystem for smart automation.

Congatec is participating in the 'Smart Factory & Automation Industry Exhibition' held at COEX in Seoul from March 27 to 29 (Booth number D243) and is showcasing a diverse range of smart automation application-ready building blocks.

At this exhibition, modules based on Intel Core Ultra processors with integrated AI capabilities are scheduled to be unveiled for the first time, along with virtualization-ready computer-on-modules across all performance classes for system integration.

Congatec introduces enhanced performance and energy efficiency, as well as Industrial Internet of Things (IIoT) and security features never before provided by existing computer-on-modules.

These features not only significantly improve the application readiness of computer-on-modules but also perform various modern functions, contributing to the efficient and stable development of fully connected embedded and IIoT devices, thereby strengthening the competitiveness of Congatec products.

Kim Yoon-sun, CEO of Congatec Korea, stated, “As IIoT presents a new challenge for OEMs, Congatec, as a Computer-on-Module supplier, is providing expanded capabilities including COM-HPC, COM Express, SMARC, and Qseven-based modules,” and“For example, the Congatec module has pre-built-in hypervisor functionality and supports Bosch Rexroth’s ctrlX OS, enabling solution providers to leverage enhanced features and improve performance without the need to develop or integrate applications themselves,” he said.

Including these new features, this exhibition focuses on introducing the additional value to be provided to OEM customers.

OEM embedded systems must provide more features to meet both digitalization and IIoT connectivity requirements.

Congatec has the capability to meet the high demand for OEM solutions through its proprietary hypervisor technology and edge IoT capabilities. At the exhibition, it plans to unveil for the first time the benefits of integrating this suite of solutions with expanded computer-on-module capabilities.

Congatec, a global leader in embedded and edge computing in the computer-on-module field, is taking the lead in providing extended capabilities and services for the simplified integration of COM Express, COM-HPC, SMARC, and Qseven-based modules.

The implementation of extended IIoT capabilities and OS for Computer-on-Module is a result of Congatec's high value-added strategy. Congatec's high-performance ecosystem provides advanced cooling solutions optimized for individual modules, carrier boards for easy evaluation and application design, software support, and individual integration services, and in particular, helps OEMs save time and resources through testing and design services.

This enhances the ease and efficiency of module integration, providing engineers with a high level of design security and enabling customers to shorten time-to-market and accelerate the innovation cycle in a way that is optimal for them.

Congatec modules provide functionality across all areas, including processors and form factors, offering comprehensive efficiency and convenience to OEMs. Newly integrated virtualization, digitalization, and security features have set a new standard for application-ready computer-on-module capabilities, particularly in the real-time IIoT aspect.

Detailed information about the 'Smart Factory & Automation Industry Exhibition 2024', which opens on March 27, can be found on the Congatec website.