.png)
TI Launches Advanced PMBus™ Interface and Multi-Phase Vcore Solution with Smart Power Stage
Published2014.08.19 15:11
TI Korea (CEO Kent Chon, www.ti.com/ww/kr) August 19, 2014 – TI (CEO Kent Chon) has announced a complete multi-phase core voltage (Vcore) power management system solution for enterprise servers, storage, and high-end desktop applications. The new TPS53661, TPS53641, TPS53631 DC/DC controllers and CSD95372B, CSD95373B NexFET smart power stages, which are compatible with Intel's VR12.5 and VR12 voltage regulation specifications, represent a cutting-edge digital multi-phase solution that drives the latest Intel Xeon® processors. This complete solution boasts industry-leading efficiency of up to 95% in a minimum footprint form factor.
The TPS53661, TPS53641, and TPS53631 DC/DC controllers support 6, 4, and 3-phase operation respectively and incorporate TI's advanced D-CAP+™ control architecture and a comprehensive set of PMBus command functions. The CSD95372B and CSD95373B synchronous buck NexFET smart power stages integrate intelligent drivers and power MOSFETs in a compact 5mm x 6mm package. With this comprehensive configuration, these products enable the implementation of a complete multi-phase Vcore system solution featuring excellent transient response characteristics, industry-benchmark telemetry accuracy, and superior system reliability.
TI's D-CAP+ architecture provides ultra-fast transient response characteristics and is designed with a unique approach to eliminate beat frequency. The TPS53661, TPS53641, and TPS53631 ensure robust multi-phase regulator operation through dynamic current distribution and cycle-by-cycle current limiting. The mixed analog and digital topology delivers lowest standby power consumption and ultra-fast dynamic performance with maximized flexibility in an industry-leading 5mm x 5mm package form factor.
The CSD95372B and CSD95373B feature current feedback with 3% accuracy, eliminating the need for inductor DC resistance (DCR) sensing, and achieve high power density with best-in-class thermal performance. Additionally, the optimized package footprint with DualCool™ packaging option enables simplified layout and improved heat sinking implementation.
Related news
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
ST Launches 75V Drive IC Targeting 48V Industrial Motor Driving
ST Microelectronics has unveiled the 'STSPIN9P' series of 75V motor drive ICs tailored for 48V-class industrial drive system design. The new product family is characterized by half-bridge and full-bridge configurations that enable design scalability according to motor type and output conditions. Power supply circuits, protection functions, and current sensing circuits are integrated on-chip to simplify system configuration, and the devices are designed to support applications up to 500W maximum. The company plans to provide reference designs and demo boards to support development and evaluation in industrial automation, robotics, pumps, fans, lighting, and textile machinery.
2026.03.26by 배종인 기자
Nordic supports security updates for the entire lifecycle of IoT devices at a single fixed cost
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, has unveiled a single fixed-cost licensing model that delivers FOTA (Firmware Over-the-Air) and device management capabilities throughout the device lifecycle via nRF Cloud, and introduced a new firmware update solution to prepare for the enforcement of the European Union's Cyber Resilience Act (CRA).
2026.03.26by 배종인 기자
Practical Training in Low-Noise, Low-Power Circuit Design All in One Place… Training Fee Support
The "2026 Advanced Engineer Practical Masterclass" to strengthen competencies in high-sensitivity analog circuit and sensor-based system design will be held on April 16 at the e4ds Conference Center in Gasan-dong, Seoul. This program will be conducted as an offline paid hands-on training session, not online, and is targeted at engineers seeking on-site intensive learning. Texas Instruments will provide educational support for this training, allowing participation at 150,000 won, a 100,000 won discount from the original price of 250,000 won.
2026.03.26by 배종인 기자
