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KLA-Tencor Launches Core System to Support 5D™ Patterning Control Solutions
August 27, 2014—KLA-Tencor Corporation (NASDAQ: KLAC) today launched WaferSight™ PWG (Pattern Wafer Shape Metrology System), LMS IPRO6 (Reticle Pattern Registration Metrology System), and KT Analyzer® 9.0 (Advanced Data Analysis System). These three new products support KLA-Tencor’s unique 5D™ patterning control solution, which addresses five elements of patterning process control: devices with three-dimensional structures, time to result, and overall equipment efficiency. This 5D patterning control solution is being developed with the goal of achieving optimal patterning results through characterization, optimization, and process monitoring inside and outside the lithography module. By combining these metrology instruments with intelligent feedback and feedforward process control loops, this solution enables chipmakers to increase production speed and cost-effectiveness while using existing process equipment for advanced patterning techniques, including multi-patterning and spacer pitch splitting.
"Process control plays a critical role in helping customers handle near-zero process margins, overlay margins, and other complexities associated with innovative patterning techniques," said Ahmad Khan, Vice President of KLA-Tencor's Parametric Solutions Group. "The Archer™ 500 overlay system and SpectraShape™ 9000 CD measurement system will identify and monitor patterning errors in lithography modules, while the new WaferSight PWG system and LMS IPRO6 system are used to block and manage various patterning error sources beyond the scope of lithography cells—specifically, other semiconductor unit processes including the reticle and other parts of the lithography cell." "This comprehensive measurement solution, applicable throughout the semiconductor factory, enables increased process margins and enhanced patterning control in actual production based on the flexible data analysis capabilities of KT Analyzer 9.0," he explained.
WaferSight PWG has already been installed at various IC manufacturers for the development and production of advanced IC devices, assisting chipmakers in identifying and monitoring process variations affecting patterning by measuring the geometry of patterned wafers caused by various processes. As the only device in the industry to measure wafers vertically, it minimizes deformation caused by gravity and generates highly accurate wafer shapes based on 3.5 million data samples per wafer. Feeding this data forward to lithography modules allows for improved pattern overlays through scanner modifications that optimize process-induced shapes. Additionally, WaferSight PWG features a unique capability to generate wafer thickness measurements by simultaneously measuring the front and back sides of the wafer. This measurement data is used to reduce scanner focus errors caused by thickness variations within the wafer. The WaferSight platform, which underpins WaferSight PWG, is widely used by wafer manufacturers worldwide for silicon wafer product quality inspection.
LMS IPRO6 is used to comprehensively control and characterize reticle pattern placement errors, which are the direct cause of wafer-level pattern overlay errors in major mask shops. LMS IPRO6’s unique model-based measurement technology accurately and reliably measures not only standard registration marks but also the reticle registration of patterns within actual device cells. By providing much faster speeds and higher sampling rates, it enhances the accuracy and reliability of mask quality judgments. With measurement times reduced by more than three times compared to previous models, LMS IPRO6 supports the superior productivity required to verify a large number of reticles in innovative multi-patterning techniques. By measuring registration errors in actual device patterns, LMS IPRO6 not only improves feedback transmitted to e-beam mask writers but can also feed forward data to lithography modules in semiconductor factories for optimized scanner correction, thereby improving actual device patterning that may not align with standard registration marks at the wafer level.
KT Analyzer 9.0, installed at various semiconductor and memory manufacturers, is the latest version of an industry-standard platform capable of advanced real-time data analysis across various measurement system types, including overlay, reticle registration, wafer geometry, film, CD, and profile measurement systems. KT Analyzer 9.0 features a built-in inline function that calculates scanner corrections on a lot-by-lot basis for each product. This function, which maintains high accuracy without requiring measurement data for the entire wafer, represents a control technique applicable to production processes that can reduce pattern overlay errors. In addition, KT Analyzer 9.0 includes new scanner fleet management, scanner data analysis, and scanner alignment optimization functions, providing the only solution that enables chipmakers to increase scanner utilization and monitor and optimize lithography processes.
WaferSight PWG, LMS IPRO6, and KT Analyzer 9.0 are components that make up KLA-Tencor's comprehensive 5D patterning control solution, which also includes overlay, film, CD, and profile measurement systems, as well as PROLITH™ lithography and patterning simulators. To continuously support the high performance and productivity requirements of advanced IT manufacturing environments, KLA-Tencor supports the WaferSight PWG, LMS IPRO6, and KT Analyzer 9.0 systems through a comprehensive global service network. Further information is available on the 5D patterning control solution web page.
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