By installing a bionic hearing aid module in personal audio devices such as MP3 players or smartphones, the wearer can not only electronically 'open' or 'close' sound according to ambient noise conditions, but also amplify ambient sounds with programmed audio through the connected smart device. This feature allows for the complete blocking of noise when the surroundings are too loud and enables natural conversation with others without the need to remove the audio device, thereby preventing discomfort caused by obstruction and, furthermore, pain caused by loud noise.

Bionic hearing modules can also be equipped with various advanced electronic components, such as head tracking or other sensing, to further enhance the on-the-go audio experience, and can provide new and exciting features such as augmented audio guidance or biometric monitoring.

The multi-mode audio function of the bionic hearing aid module is enabled through HD-PA® technology developed by Soundchip. In addition, thanks to patented Soundstrate® technology, implementation in a small form factor was possible, allowing electronic, acoustic, and transmitting devices to be efficiently combined within a single compact mechanical structure.

The semiconductor components of the bionic hearing aid module consist of ST’s latest motion and audio MEMS products, including an HD-PA® compatible audio engine that enables latency-free sound processing and an ultra-low power STM32 MCU. This ultra-low power STM32 MCU is part of ST’s industry-leading portfolio of over 500 32-bit ARM® Cortex®-M core microcontrollers.

AT&S was responsible for the packaging of the bionic hearing aid module. It utilizes AT&S's latest ECP® (Embedded Component Packaging) and 2.5D® PCB technologies. This technology enables highly efficient integration of acoustic, electro-acoustic, passive, and active electronic components, providing a module that takes into account various factors such as sizing specifications suitable for in-ear operation and comfortable fit, and is compatible with most in-ear personal audio devices.

“Soundchip CEO Mark Donaldson said, ‘Soundchip has led the smart wearable sound sector for major companies in the consumer goods, mobile, and aviation markets over the past four years.’ “Customers have responded encouragingly, and I believe consumers are now ready to experience smart, software-based wearable sound devices,” he said.

"To implement biomechanical hearing aid technology, high-performance silicon components with excellent durability and stability must be interconnected within a complex structure, and the fit must also be comfortable," said Andrea Onetti, General Manager of ST’s Mass MEMS and Analog business unit. "By combining ST’s advanced MEMS and microprocessor devices and sound chips with AT&S’s complementary solutions, we were able to achieve the right combination of technology and know-how to provide these innovative solutions."

“Small form factor devices that can be worn inside the ear require highly integrated design and advanced packaging technology. As a leading provider of ECP® and 2.5D® packaging solutions, AT&S plays a key role in the realization of bionic hearing aids, and we are very pleased to be able to bring such outstanding technology to market in collaboration with Soundchip and ST,” said Michael Tschandl, Vice President of Advanced Packaging Sales at AT&S.

Samples of this bionic hearing aid module are scheduled to be supplied to customers starting in the second quarter of 2015.