The launch of the new TDA3x processor provides a cost-effective ADAS SoC for front, rear, and surround view applications.

TI Korea (CEO Kent Chon, www.ti.com/ww/kr ) October 28, 2014 – As governments around the world encourage consumers to purchase safer vehicles, automakers are striving to design cars that achieve increasingly higher New Car Assessment Program (NCAP) scores. To meet these demands, TI (CEO Kent Chon) has launched the TDA3x solution, a new family of automotive System-on-Chip (SoC) products. By utilizing the TDA3x processor, automakers can meet NCAP requirements and design sophisticated Advanced Driver Assistance Systems (ADAS) applications that reduce collisions on the road and enable enhanced autonomous driving experiences in entry-level and mid-size vehicles. Developed based on the same architecture as other TDA devices, the TDA3x series, in addition to the TDA2x series, offers a diverse range of solutions for front cameras, surround view, and fusion applications, as well as smart rear cameras and radar applications.

Development of Scalable ADAS Applications for Entry-Level and Mid-Size Vehicles
The TDA3x series, which further diversifies TI’s highly integrated and compatible automotive processor family, supports ADAS algorithms such as lane keeping assist, adaptive cruise control, traffic sign recognition, pedestrian and object detection, forward collision warning, and reverse accident prevention. This algorithm plays a crucial role in effectively executing various types of ADAS applications, such as front cameras, surround view, fusion, radar, and smart rear cameras. By utilizing the TDA3x processor, customers can design ADAS applications that meet cost-sensitive NCAP programs, such as Autonomous Emergency Braking (AEB) for pedestrians and two-wheeled vehicles, Forward Collision Warning (FCW), and Lane Keep Assist (LKA).

The new TDA3x processor, developed based on the same architecture as other SoC products on the TDA platform, enables automotive customers to recycle investment in product development and rapidly develop advanced ADAS capabilities in affordable models by providing a variety of hardware and software-compatible device products. The TDA3x SoC is based on a heterogeneous scalability architecture that includes TI's fixed-point and floating-point dual TMS320C66x DSP cores, a programmable Vision AccelerationPac (including the Embedded Vision Engine (EVE)), dual ARM® Cortex®-M4 cores, an image signal processor (ISP), and multiple peripherals.

The programmable TDA3x solution provides additional scalability to the TDA platform, enabling customers to differentiate their products and keep up with the rapidly changing market demands. Additionally, by providing the TI Vision SDK software library, it allows customers to utilize ADAS solutions suitable for a wide range of vehicle types, from entry-level to high-end, based on the same platform. This allows for the easier and faster development of optimized algorithms, thereby reducing investment and costs and accelerating time-to-market.

Industry's first PoP (package on package) solution for automotive
The TDA3x SoC enables the miniaturization of ADAS camera and radar systems by launching the automotive industry's first Package on Package (PoP) containing both DDR and flash memory. By mounting memory and flash on top of the TDA3x package, footprint and board complexity can be reduced, allowing for increased processing performance without increasing the module size. Several memory manufacturers, such as Micron, ISSI, and Winbond, are scheduled to supply custom PoP memory for the TDA3x SoC.

Reducing system cost, complexity, and size by integrating ISPs
The TDA3x processor achieves enhanced image quality while reducing the size, cost, and complexity of solutions by integrating an ISP that enables raw/Bayer sensors. TDA3x SoC products feature comprehensive ISP capabilities, including noise filters, color filter arrays, Video Noise Temporal Filtering (VNTF), and exposure and white balance control, while Wide Dynamic Range (WDR) and Lens Distortion Correction are optionally supported. The ISP supports various combinations of mono, stereo, and up to four camera inputs, enabling the most integrated solutions in the industry.

Safer car design possible through enhanced 'functional safety'
TI's TDA3x processors were developed to meet the requirements of the ISO 26262 'functional safety' standard. The TDA3x processor enhances the safety concept of the existing TDA2x platform by borrowing various diagnostic capabilities from TI's award-winning Hercules TMS570 safety MCU family. By combining hardware, software, tools, and support, customers using the TDA3x processor can design systems that meet demanding functional safety requirements and achieve system-level functional safety certification more efficiently.

Maximize performance and reduce system size and cost by integrating PMICs
TI enables customers to shorten development time and reduce risk by providing a Power Management IC (PMIC) for use with the TDA3x processor. This PMIC supports all performance levels of the TDA3x solution and includes all power management functions required to minimize system power consumption. In addition, this high-density PMIC meets the space-constrained requirements of ADAS applications and reduces system costs.

Price and Supply Timing
TI's TDA3x processor is currently being supplied as a sample and is designed for mass-production automotive customers. The TDA3x solution is available in two package types, 15x15mm and 12x12mm PoP, and provides the complete TI Vision SDK, EVE, and DSP libraries. For more information about these products, you can contact TI Korea.

More detailed information:
• TDA3x and Surround View White Paper
• Description of TI's ADAS solutions and TDA3x
• Ask the Expert video on POP and ISP
• TDA3x Video Series
• Behind the Wheel blog, where you can explore the latest trends in the automotive industry
• TI E2E™ Community
• TI Twitter and Facebook