TI Launches DLP® High-Resolution Chipset for 3D Printing, 3D Machine Vision & Lithography Applications
Published2014.11.12 15:21Scan and design larger and more precise objects with up to 4 million high-speed pixels
TI Korea (CEO Kent Chon, www.ti.com/ww/kr ) November 6, 2014 – TI (CEO Kent Chon) announced the release of two new high-resolution DLP® chipsets for 3D printing, 3D machine vision, and lithography applications. These chipsets combine the DLPC900 controller with the DLP9000 and DLP6500 Digital Micromirror Devices (DMDs), respectively. They provide higher resolution images compared to previous devices, support an extended range of wavelengths, and offer faster pattern speeds.1) Additionally, the corresponding DLP LightCrafter™ evaluation modules, the DLP LightCrafter 9000 and 6500, are provided, enabling developers to rapidly evaluate the chipsets and reduce product development time. (For more information, please refer to www.ti.com/dlphighresolution )
The DLP9000 is a DMD that provides 4 million pixels (2560 x 1600 micromirror array), the highest resolution among TI DLP products, and can be utilized in a variety of applications. By using this chipset, larger and more precise objects can be fabricated via 3D printing, and in the case of scanning, larger objects can be scanned from longer throw distances. The DLP6500 provides up to 2 million pixels (1920 x 1080 / 1080p) micromirror array for cost-sensitive applications.
The DLPC900 controller provides an interface to enable reliable high-speed control of the DMD. It supports multiple DMDs with a single controller, providing customers with the flexibility to design various high-performance systems using a single platform design.
Key Features of DLP9000 and DLP6500 Chipsets
• Diverse product portfolio allows you to choose the optimal performance and price
• Provides programmable pattern speeds of up to 9,500Hz, enabling faster 3D measurement and product manufacturing.
• Optimized for wavelengths of 400nm to 700nm, making it compatible with resins widely used in 3D printing and resists for lithography.
Key Features of DLP LightCrafter 9000 and 6500 Evaluation Modules
• Standard USB, HDMI, and I2C interfaces enable developers to easily implement designs suitable for various applications.
• Efficient real-time chipset programming possible with an easy-to-use GUI
TI is building a comprehensive ecosystem composed of multiple design vendors to shorten the development time of finished products. The DLP Design Network provides a comprehensive network of vendors for developer support, including hardware and software integration, optical design, system integration, prototyping, manufacturing services, and turnkey solutions that meet rapidly changing customer needs.
Supply and packaging
The DLP9000 is available in a 355-pin sealed FLS package, and the DLP6500 is available in 350-pin ceramic FYE and 203-pin sealed FLQ packages. Additionally, the DLPC900 controller is available in a 516-pin BGA package. These products are currently available for bulk purchase through TI authorized distributors, and DLP LightCrafter 9000 and 6500 evaluation modules are available for purchase at the TI e-store.
More detailed information about DLP products:
• Watch the video about the DLP9000 and DLP6500 chipsets
• Search for solutions and share ideas with fellow engineers and TI experts in the DLP product and MEMS forums of the TI E2E community.
• DLP Design House Network
• Check the design method using DLP technology on the “Getting Started” page
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