December 4, 2014, Seoul - Infineon Technologies (Korea CEO Lee Seung-soo) has launched a bipolar power module employing solder bond technology for cost-sensitive applications. By adding these new PowerBlock modules to its portfolio, Infineon has further diversified its power module lineup, which previously consisted solely of pressure contact bonded modules. Infineon now provides optimized solutions tailored to the cost and performance requirements of different applications including industrial drives, renewable energy, soft starters, UPS (uninterruptible power supply) systems, welding equipment, and static switches.

Solder bond modules offer approximately 25 percent lower market pricing compared to pressure contact bonded modules and feature more compact package sizes down to 50mm, providing superior cost competitiveness. The miniaturized solder technology PowerBlock modules are well-suited for applications such as standard drives and UPS systems, as these applications do not specifically require the high robustness of pressure contact bonded technology. For applications demanding high robustness such as soft starters and static switches, pressure contact bonded modules are more appropriate. For example, in input rectifier applications operating directly under harsh phase voltage conditions, robustness requirements increase depending on module size, necessitating highly reliable pressure contact bonding technology.

The new PowerBlock modules consist of package types with base plate widths of 20mm, 34mm, and 50mm. Infineon provides major current ratings for each package size and offers 1600V blocking voltage across all module types. Infineon is the only company providing 20mm, 34mm, and 50mm modules that can be adapted to different applications. Modules using solder bond technology are suited for cost-sensitive standard industrial solutions, while modules using pressure contact technology are appropriate for high current applications and applications requiring maximum reliability.

PowerBlock modules employ insulated copper base plates to achieve lower transient thermal resistance compared to modules using only DCB substrates for heat transfer to the heat sink. This provides higher robustness under overload conditions. Furthermore, PowerBlock solder modules utilize optimized housing and cover structures to minimize twisting when main terminals are screw-fastened and provide superior soldering quality. Additionally, these module products exhibit very low power losses, achieving high system efficiency.

Availability

Mass production of 1600V PowerBlock modules (20mm and 34mm) with solder bond technology in various current ratings will commence in the fourth quarter of 2014, and 1600V PowerBlock 50mm solder modules will begin sample supply starting in the first quarter of 2015.