– Package design offered royalty-free for unrestricted use

December 18, 2014, Seoul - Infineon Technologies (Korea CEO Lee Seung-soo) has launched a new power module platform designed to enhance the performance of high-voltage IGBTs with voltage ratings ranging from 1200V to 6.5kV. To enable widespread adoption of the new module's benefits, Infineon provides royalty-free design licenses to all IGBT power module manufacturers. The first products utilizing this platform are offered in a new 100mm x 140mm x 40mm package in high-voltage ratings of 3.3kV (450A), 4.5kV (400A), and 6.5kV (275A). These new module products will be showcased at the PCIM exhibition held in Nuremberg, Germany from May 19-21, 2015. Additionally, package designs for lower voltage ratings are under development.

Reliable, high-performance IGBT modules are a core technology for electrical switching in industrial and traction drives, wind and solar energy systems, and long-distance power transmission systems. Over more than 20 years of use, IGBTs have met demands for higher energy efficiency, higher operating temperatures, miniaturization, reliability, and cost reduction while making minimal changes to standard packaging technology, thanks to advances in chip technology. However, as applications increasingly operate in more demanding and harsh environments, this approach has reached its limits, making it impossible to achieve continued performance improvements without modifying the packaging technology of high-power modules.

The new module platform developed by Infineon meets the high demands of modern systems for high power density, energy efficiency, long service life, and robustness. It also offers exceptional flexibility, allowing similar modules to be connected in parallel, enabling simplified structures in DC link terminals and capacitors. AC terminals can be connected in parallel using only a single busbar. The flexibility and scalability of this new module greatly simplify system design, enabling developers to shorten time-to-market.

Markus Hermwille, Director of High-Power Division at Infineon Technologies' Industrial Power Control Business Unit, stated: "We are pleased to provide a package design that addresses not only current demands but also future requirements as demands for IGBT technology continue to increase. This new module package will fully demonstrate its value in all demanding high-power applications. Infineon hopes to establish a reliable supply base by expanding the foundation of the new high-power platform. That is why we are making this design available for use by the entire industry."

More detailed information about this new high-power platform can be found at www.infineon.com/theanswer.