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Infineon Shipped Over 1 Billion Chip Scale Package (CSP) TVS Diodes in 2014
February 27, 2015, Seoul — Infineon Technologies (Korea Representative Director Seung-soo Lee) announced that shipments of ultra-small TVS diodes, which protect electronic products from electrostatic discharge (ESD), have reached a new milestone. In 2014, Infineon supplied more than 1 billion TVS diodes to customers in bare silicon wafer-level leadless (WLL) packages.
TVS diodes in WLL packages are used in applications where miniaturization is critical, including touch screens, keypad interfaces, and high-speed data ports used in mobile devices. High signal transmission rates and small sizes increase the vulnerability of electronic devices to ESD, so the diodes used in these applications must not degrade the signal quality of the circuit. Infineon's TVS diodes are recognized for having the extremely low parasitic resistance required for high signal quality and achieve more than all requirements for protection against severe ESD as defined in the IEC 61000-4-2 standard.

The Infineon SG-WWL-2-1 package has an ultra-small footprint (0.58 mm x 0.28 mm) and a thickness of only 0.15 mm. This package is designed to be attached directly to a PCB adjacent to a connector, such as a USB port, or an external contact point, such as a control button or touchpad. Since an average of 10 to 30 TVS diodes are used in general electronic products, ultra-small packages offer a significant advantage in achieving the goal of miniaturizing electronic products without compromising performance.
The ESD200-B1-CSP0201, a versatile diode available in a WLL package from Infineon's TVS diode portfolio, protects human/device interface points such as touchscreens, keypads/boards, buttons, and audio/headset input ports. Designed to clamp electrostatic discharge to a voltage level of just 12V, the diode's bidirectional characteristics simplify assembly on PCBs in high-volume production lines. The diode absorbs ESD strikes of up to ±16,000V for air and contact discharge, whereas standard tests specified by IEC61000-4-2 require safety for contact discharge at only ±8,000V.
The ESD108-B1-CSP0201 diode is designed to protect high-speed interfaces and features an exceptional combination of a low clamping voltage of 20V for ±8000V contact discharge and a low parasitic capacitance of 0.28pF, typically seen at 1MHz. Both the low clamping and parasitic capacitance ensure critical signal integrity. The diode absorbs ESD strikes of up to ±25000V for air and contact discharges. This far exceeds standard requirements of ±8000V contact and ±15000V air discharge.
Design support for ESD protection
Infineon supports customer programs through expert consultation and an extensive library of simulation models for TVS diodes to enable the design of systems that provide ESD robustness and protection. More information about Infineon's TVS (Transient Voltage Suppressor) diodes can be found at www.infineon.com/tvsdiodes.
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