congatec, a global leader in embedded and edge computing technologies, is leading the way in high-performance, low-power edge computing platforms with the launch of its COM-HPC Mini module featuring Qualcomm Dragonwing IQ-X.

congatec announced on the 26th that it has launched the COM-HPC Mini Computer-on-Module (COM) conga-HPC/mIQ-X, the first to feature the Qualcomm Dragonwing IQ-X series processor.

This new product is based on the Qualcomm Oryon CPU and provides outstanding single and multi-threaded computing performance previously only possible on existing x86 systems, along with the highest level of power efficiency.

conga-HPC/mIQ-X supports edge AI on-device machine learning (ML) and large-scale language model (LLM) execution, and implements AI performance of up to 45 TOPS through a dedicated NPU based on the Qualcomm Hexagon processor.

This meets the growing demand for high-performance, low-power computing platforms in diverse markets, including security, retail, robotics, medical devices, and industrial automation.

The ultra-compact, credit card-sized module measures 95mm x 70mm and features onboard high-speed LPDDR5X RAM and a rugged design supporting an extended industrial temperature range of -40°C to 85°C. Equipped.

Key applications include video surveillance systems, edge analytics sensors and cameras, and on-device AI processing applications.

It is also suitable for developers who want to leverage the strengths of Arm in a Microsoft Windows environment, and significantly reduces development time with UEFI-compatible firmware and simplified software integration.

conga-HPC/mIQ-X processes video, image, and audio data at ultra-low power with up to 12 Orion CPU cores, dedicated Hexagon NPU, DSP, and Qualcomm Spectra ISP.

Additionally, the built-in Qualcomm Adreno GPU provides powerful graphics performance, supporting up to three displays and 8K resolution.

For high-speed networking and peripheral connectivity, it supports △2 x 2.5GB Ethernet, △up to 16 PCIe Gen3/Gen4 lanes, △2 x USB4, △2 x USB3.2 Gen2x1, and △8 x USB 2.0.

Graphics output is provided via two DDIs and eDP, and up to four cameras can be directly connected to MIPI CSI.

It also supports expansion functions such as △2 I2Cs, △2 UARTs, and △12 GPIOs, and enhances hardware-based security by integrating a TPM 2.0 module.

congatec provides optimized cooling solutions, evaluation boards and comprehensive design support to accelerate time to market.

The new module is also available as application-ready aReady.COM, pre-installed with a proven operating system and including software building blocks for implementing IoT functionality, helping to optimize development efficiency and costs.

Konrad Garhamer, COO and CTO of congatec, said: “conga-HP“C/mIQ-X takes embedded Arm compute performance to a new level,” he said. “With UEFI BIOS support, Windows integration, and a complete ecosystem, it will greatly simplify the development of AI-accelerated edge and vision systems.”