Onsemi, a global leader in intelligent power and sensing technologies, has optimized electric vehicle, solar, and energy storage systems with its EliteSiC MOSFETs using next-generation cooling packaging technology.

Onsemi officially announced on the 9th its new EliteSiC MOSFETs in the industry-standard T2PAK top-cool package.

This new product simultaneously delivers superior thermal performance, reliability, and design flexibility required in high-power, high-voltage applications such as electric vehicles, solar infrastructure, and energy storage systems, setting a new standard for the power semiconductor market.

As power demand surges in solar inverters, electric vehicle chargers, and industrial power supplies, efficient thermal management has emerged as a key engineering challenge.

Existing packaging methods have limitations that force designers to choose between thermal efficiency and switching performance.

Onsemi's EliteSiC T2PAK solution addresses these issues by directly transferring heat generated from the PCB to the system cooling infrastructure, enabling stable operation without performance degradation.

This provides various benefits, including: low operating temperature, extended system life due to reduced component burden, high power density, compact design, and shortened product launch period.

Onsemi's ChoiThe new 650V and 950V EliteSiC MOSFET portfolio combines industry-leading SiC technology with innovative top-cool packaging. Initial products are currently shipping to key customers, with additional products expected to be released after Q4 2025.

Key features of the T2PAK top-cool package include direct heat transfer to the heatsink, overcoming the thermal limitations of the PCB, and low stray inductance for fast switching speeds and reduced energy loss.

In addition, it combines the advantages of TO-247 and D2PAK to minimize their disadvantages, and enhances design flexibility by supporting Rds(on) in the range of 12 mΩ to 60 mΩ.

This design minimizes thermal resistance from the junction to the heatsink, achieving an ideal balance between heat dissipation and switching performance.

“Thermal management is one of the most critical challenges facing power system designers in today’s automotive and industrial markets,” said Auggie Djekic, Vice President and General Manager of ON Semiconductor’s SiC Division. “ON Semiconductor’s EliteSiC technology and innovative T2PAK Top Cool package deliver both efficiency and reliability, enabling the development of differentiated next-generation products.”