Congatec, a company specializing in embedded and edge computing, is strengthening its position in the embedded AI market by unveiling a next-generation computer-on-module (COM) product line that can implement AI without external accelerators with 180 TOPS performance based on Intel Core Ultra Series 3 processors.

On the 6th, congatec announced a new COM lineup with the industry's broadest portfolio, highlighting technological advancements that enable high-performance AI inference without a separate AI accelerator.

The newly released module delivers up to 180 TOPS of computational performance, simultaneously meeting the high-performance and low-power computation demands of embedded AI applications.

This enables advanced AI capabilities in a variety of fields, including industrial automation, robotics, smart cities, healthcare, and retail POS, without the need for a separate external AI accelerator card.

Intel Core Ultra Series 3-based modules offer up to 16-core CPU configurations, 10 TOPS of CPU compute performance, 50 TOPS of integrated NPU5, and Xe3 GPU cores with up to 120 TOPS of performance, delivering enhanced performance in edge AI computing.

In this announcement, Kongatec unveiled a total of five COMs.

COM Express Mini / COM-HPC Mini is the best in size, weight and power (SWaP).It has a compact design that is red.

COM Express Compact is intended for upgrading existing systems where durability or cost-effectiveness is a priority.

COM-HPC Client is for new applications that require high performance and high bandwidth.

The conga-HPC/mPTL and conga-HPC/cPTL, which support PCIe Gen 5 and USB4, are suitable for high-speed data processing environments, while the credit card-sized conga-MC1000 is offered as an upgrade alternative for existing COM Express Type 10-based systems.

For industrial environments requiring durability, the conga-TC1000r with screw-mounted LPCAMM2 memory is available.

The new COM family is based on Intel Core Ultra Series 3 processors manufactured on Intel's 18A process, scalable up to Core Ultra X9.

Supports up to 96GB LPDDR5X memory and LPCAMM2 socket memory on some SKUs.

It also supports in-band ECC for mission-critical environments and up to three 6K display outputs.

This enables designs optimized for industrial embedded systems that require high reliability and high performance.

The operating system widely supported includes Windows 11, Windows 11 IoT Enterprise, ctrlX OS, Ubuntu Pro, Kontron OS, Linux, Yocto, etc.

Additionally, congatec provides software building blocks such as aReady.COM (pre-configured OS), aReady.VT (integrated hypervisor), and aReady.IOT (IIoT connectivity package) that enable developers to integrate real-time control, HMI, AI, and IoT gateway functionality in a single module. />
We also provide evaluation carrier boards, cooling solutions, high-speed signal integrity measurements, and design-in services to simplify application development.

“The demand for compute and AI performance in edge environments is rapidly increasing,” said Konrad Garhamer, COO and CTO of congatec. “With the acquisition of the Kontron module business, we are now able to offer the industry’s largest portfolio of Intel Core Ultra Series 3-based modules.”

“System designers can now leverage the benefits of integrated AI without the need for separate AI accelerators,” said Michael Massey, vice president of Edge Product Management at Intel. “This is a game-changer that will significantly improve the reliability and lifecycle of embedded systems.”