March 17, 2015 – Vicor (www.vicorpower.com; Country Manager Ki-Cheon Jung) announced that it has expanded its DC input Converter Module (DCM) product family, including the isolated, regulated DC-DC converter module series, into its Converter housed in Package (ChiP) power component platform.

This product series is applicable to various fields, including not only the aerospace sector but also electric vehicles (EVs)/hybrid electric vehicles (HEVs), high reliability, industry, and telecommunications/data communications. The input voltage of the DCM is 24, 28, 48, 270, 290, and 300 volts, and the output voltage is 48, 36, 28, 24, 15, 12, and 5 volts, and it supports a maximum output of 600 watts.

DCMs available with Vicor FPATM and/or ZVS regulators provide high-density, high-efficiency, and scalable source-to-load power solutions. Designers can implement integrated/complete power solutions by combining the DCM with Vicor's point-of-load (POL) regulators in the form of ChiP and SiP (System-in-Package) for the next stage.

This differentiated product combination reflects Vicor’s proprietary Power Component Design Methodology and provides excellent performance, ease of use, and reduced maintenance costs.

The DCM series can achieve 93% efficiency along with more than double the power density of conventional DC-DC converters through the application of Vicor's DC-ZVS (Double Clamped Zero-Voltage Switching) topology. By adopting a DCM with a maximum power density of 1,244 W/in³, not only can system size, space, and weight be optimized, but up to eight DCMs can also be operated in parallel without power reduction or additional circuitry. When configured with such an array, a maximum 4.8 kW DC-DC solution can be achieved.

Vicor's DCM is available in two different sizes of through-hole packages, including a 4623 (46 x 23 mm) ChiP package providing up to 600 W output and a 3623 (36 x 23 mm) ChiP package providing 320 W output.

What is the ChiP (Converter housed in Package) platform?

Vicor's ChiP platform sets a new standard for best-in-class scalable power modules. Adopting High Density Interconnect (HDI) substrate technology, including power semiconductors, control ASICs, and the latest magnetic integrated structures, ChiP provides superior thermal management to support unprecedented strategic density.

ChiP package products equipped with thermal management solutions enable customers to rapidly and predictably develop power systems that combine previously unattainable system size, weight, and efficiency. The emergence of ChiP technology has made modular power design possible, facilitating the design of high-performance power systems at an efficient cost, from AC or DC sources to the load, by utilizing proven building blocks.

Purchase Information

The price of the 3623 ChiP package product starts at $82.14 per unit based on an order of 1,000 units.

Product Inquiry

Vicor-Korea

031-620-0071

010-5205-4209

kcjung@vicorpower.com

Media Contact:

Vicor Corporation

Leno Zhu

lzhu@vicr.com