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STMicroelectronics Launches Ultra-Small MEMS Accelerometer for Medical and Wearable Devices
Ultra-low power design and 2mm package
As the markets for wearable healthcare devices and implantable medical devices expand, demand for technologies that simultaneously require small sensors and low-power designs is growing. STMicroelectronics announced the introduction of the "MIS2DU12," an ultra-small MEMS accelerometer, targeting this environment.
In a statement released in Seoul on March 11, 2026, STMicroelectronics described the sensor as combining low-power operation and a compact design, making it ideal for wearables and implantable medical devices. Key applications include medical equipment such as heart monitors, pacemakers, and skin-attached biosensors.
The MIS2DU12 is built using biocompatible materials and processes, consuming only 20 nA in power-off mode. Even in active mode, current consumption is designed to be less than 1 µA. Measuring 2 mm × 2 mm and 0.74 mm high, the sensor adopts a compact package suitable for use in skin-attached medical devices and ultra-small wearables.
The sensor contains a dedicated engine that performs motion detection functions, detecting freefall, wake-up, single and double taps, and changes in activity status. It also supports 4D and 6D orientation recognition, and is equipped with a self-test function and temperature sensor. This feature can be utilized to stably secure biosensor measurement data even in environments with a lot of movement.
This product is designed to reduce signal distortion caused by external vibrations by incorporating an anti-aliasing filter along with event detection. This reduces the computational burden on the application processor and lowers system power consumption, the company explains. In ultra-low power mode, it consumes approximately 0.47µA, and in normal operation mode with the filter enabled, it consumes approximately 5.6µA.
The MIS2DU12 offers a measurement range from ±2g to ±16g, and the output data rate can be set from 1.6Hz to 800Hz. The operating temperature range is -40°C to +85°C, and a 128-level FIFO buffer provides flexibility in data storage and power management. The product is currently in production in an LGA package and is expected to be available from the end of the first half of 2026. ST is unveiling the sensor at the Embedded World 2026 exhibition in Nuremberg, Germany.
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