April 30, 2015 – KLA-Tencor announced two new systems (CIRCL-AP™ and ICOS® T830) to support advanced semiconductor packaging technologies. Designed to characterize and monitor the various processes used in wafer-level packaging, CIRCL-AP performs full surface wafer defect inspection, precision review, and metrology with high throughput. ICOS T830 provides fully automated optical inspection capabilities for IC (integrated circuit) packages and utilizes the high sensitivity of 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. Both systems incorporate innovative packaging techniques to help IC manufacturers and OSAT (Outsourced Semiconductor Assembly and Test) facilities address challenges such as finer feature sizes and denser pitch requirements.

Brian Trafas, Chief Marketing Officer at KLA-Tencor, stated, “Consumer mobile electronics technology continues to drive the production of smaller, faster, and more effective devices,” adding, “Advanced packaging technology provides performance benefits to devices, such as increased bandwidth or improved energy efficiency. However, packaging production methods are becoming more complex, requiring the implementation of typical front-end IC manufacturing processes like chemical and mechanical planarization or high-image-ratio etching, as well as unique processes such as temporary bonding or wafer restoration.” “KLA-Tencor has combined its expertise in front-end semiconductor manufacturing process control with experience gained through collaboration with R&D sites and industrial consortia to develop a flexible and efficient inspection solution that can help solve various packaging challenges from the wafer level to the final component,” the company explained.

CIRCL-AP includes complex modules that utilize parallel data collection for cost-effective, high-speed process control for advanced wafer-level packaging processes. It also supports various packaging technologies, including wafer-level chip-scale packaging, fan-out wafer-level packaging, and 2.5D/3D IC integration using Through Silicon Via (TSV). The industry-proven 8-Series serves as the front-side defect inspection and metrology module for CIRCL-AP; these capabilities combine LED scanning technology with automated binning to reduce non-defective distractions and improve the detection speed of critical packaging defects, such as TSV cracks and redistribution layer shorts. The CV350i module, based on KLA-Tencor's VisEdge® technology, enables leading detection, classification, and automated precision inspection of wafer edge defects and metrology during critical edge trimming and bonding steps in the TSV process flow. The Micro300 module, featuring various imaging and lighting modes, can perform high-precision 2D and 3D metrology for bump, redistribution, and TSV processes. By utilizing a flexible architecture, the CIRCL-AP can be configured into one or more modules, allowing it to address the requirements of specific packaging applications. In addition, the wafer transport handler supports bonded, thinned, and curved substrates.

The ICOS T830 expands the industry-leading ICOS semiconductor device inspection series to address yield challenges associated with advanced packaging types, including leadframes, fan-out wafer-level, flip-chip, and stacked packages. Through xPVI™, an advanced package appearance inspection feature, high-sensitivity detection of surface defects on the top and bottom of the package (e.g., voids, scratches, pits, chip damage, and exposed wires) is possible. To meet quality standards for state-of-the-art memory and logic package equipment, the ICOS T830 provides high-speed 3D ball, lead, and capacitor measurements, package z-axis measurements, and component side inspection capabilities. The xCrack+ inspection station enables accurate detection of microscopic crack defects, a major failure mechanism for the thinner components used in mobile applications. The ICOS T830 achieves cost-effective component quality control by integrating high-throughput operations across four independent inspection stations with high-speed sorting of inspected package components.

Various CIRCL-AP systems of diverse configurations are installed worldwide and utilized for TSV development and production, fan-out wafer-level packaging, and other wafer-level packaging technologies. The ICOS T830 system is used in numerous IC packaging facilities globally and provides accurate feedback on package quality for various device types and sizes. Through KLA-Tencor's global comprehensive service network, CIRCL-AP and ICOS T830 systems are supported to maintain the high performance and productivity required by semiconductor packaging suppliers. Additional information about CIRCL-AP and ICOS T830 can be found on the Packaging Process Control web page.