June 1, 2015, Seoul - Infineon Technologies (Korea CEO Lee Seung-soo) has launched a new generation of PrimePACK™ power modules combining the latest IGBT5 and innovative .XT interconnection technology. IGBT5 enables higher power density by reducing static and dynamic losses, while .XT interconnection technology extends lifetime by improving thermal and power cycling performance. Therefore, the new PrimePACK module is an excellent solution for high-power inverters used in wind power generation, solar, and industrial drive applications.

Infineon's latest IGBT5 chip adopted in the new PrimePACK module enables a maximum operating junction temperature 25K higher, allowing a maximum junction temperature Tvjop=175°C. In addition, it achieves improved soft-switching operation compared to the previous generation product and reduces total losses. Therefore, it enables higher power density for 1200V and 1700V applications. As a result, the output current of the application can be increased by up to 25 percent with the same PrimePACK footprint.

By strengthening the foundation that PrimePACK has established today and enhancing it using Infineon's innovative .XT interconnection technology, it is now possible to meet current and future lifetime requirements. This has been achieved through sintering IGBT chips and diodes, improving system soldering in addition, and using copper bonds instead of aluminum bonds. Applications can gain significant advantages as the PrimePACK module lifetime is improved by up to 10 times.

Furthermore, by combining IGBT5 and .XT technology with PrimePACK, great flexibility is provided to system designers. By using PrimePACK modules with IGBT5, designers can increase the output power of the application by up to 25 percent, or alternatively, with the same output current, extend the lifetime by up to 10 times. With the same output current, cooling can be greatly reduced, and on the other hand, higher system overload conditions become possible. In this way, various trade-offs between output power and lifetime are possible. By utilizing such design flexibility, optimal implementation can be achieved according to the system application.

The new PrimePACK™ 3+ housing for high-current modules provides additional AC terminals and bus bars to enhance current transfer performance, and additional control terminals enable low-inductance connection to the collector of the lower IGBT.

More detailed information on PrimePACK power modules can be found at www.infineon.com/PrimePACK.