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IDT Expands Cloud Computing Portfolio by Unveiling Thermal Sensors for DDR3 Memory Modules

Google 우선 소스Published2011.06.01 17:26

IDT Expands Cloud Computing Portfolio by Unveiling Thermal Sensors for DDR3 Memory Modules

New high-accuracy devices in enterprise computing applications
Reduce power consumption of the memory subsystem and improve stability and performance.

IDT ( www.idt.com , Country Manager for Korea: Sang-Yup Lee), an analog-digital company leading the core mixed-signal semiconductor solutions market, today introduced a new family of low-power, precision temperature sensors targeting DDR2 and DDR3 memory modules, SSDs, and computing motherboards. These devices complement IDT’s PCI Express®, signal integrity, flash memory controller, power management, and timing products, further expanding the configuration of enterprise computing solutions optimized for various applications.


These newly introduced digital thermal sensors support both 3.3V and low-power 2.5V SM-Bus and I2C interfaces to improve system power efficiency while maintaining compatibility with both existing and emerging serial bus controllers. To further reduce power consumption, advanced on-die power management specifications minimize power usage in critical modes, such as when mobile systems or fault-tolerant, non-stop enterprise systems operate on battery power. The new product family includes a standalone temperature sensor (TS3000GB2), as well as a product (TSE2002GB2) in which a 256-byte EEPROM array is integrated into a single monolithic die for non-volatile storage of user information, such as system configuration data for the memory module SPD (Serial Presence Detect) function.

These devices exhibit a temperature sensing accuracy of ±1°C over the entire temperature range of -20°C to +125°C. Furthermore, by achieving performance levels exceeding those specified in the JEDEC (Joint Electron Device Engineering Council) JC42.4 specification, IDT continues its traditional technological leadership in temperature accuracy. Additionally, through an innovative high-performance analog-to-digital converter (ADC), it achieves programmable resolution of up to 12 bits (0.0625°C) with industry-leading conversion times, significantly enhancing precision across the entire temperature range.

Arthur Sainio, Senior Product Manager at SMART Modular Technologies, stated, “Our customers are constantly demanding superior system stability and power efficiency, and IDT’s thermal sensors are very helpful in addressing these demands.” He added, “IDT has introduced such a comprehensive portfolio of high-performance computing solutions.

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