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Samsung Electronics Mass-produces Industry's First Ultra-small 1.0㎛ Pixel Mobile Image Sensor

Google 우선 소스Published2015.08.07 18:05
◇ Mass production of 16-megapixel image sensor using ultra-small 1.0㎛ pixels
◇ Camera module thickness of 5mm or less, supporting slimmer mobile device designs
Samsung Electronics announced that it will mass-produce the industry's first ultra-small 16-megapixel mobile CMOS image sensor (CIS) with a pixel size of 1.0㎛ (micrometer, one millionth of a meter).
This product utilizes a 16-megapixel image sensor with the smallest currently achievable 1.0㎛ pixels, which reduces the focal distance between the sensor and the lens, thereby enabling the minimization of the camera module's size and thickness. This product is optimized for ultra-slim mobile devices that require high-quality camera capabilities and a thin profile. The camera module using this image sensor can have a thickness of 5mm or less, making it about 20% thinner than the existing 16-megapixel camera module using 1.12㎛ pixels, which allows for the minimization of smartphone thickness.
To make a sensor module with the same number of pixels smaller, the size of the pixels must be reduced; however, reducing the pixel size decreases the amount of light absorbed, raising concerns about a decline in image quality.
Samsung Electronics has achieved image quality equivalent to that of existing 1.12㎛ pixels with 1.0㎛ pixels by reducing light loss through the application of its proprietary 'ISOCELL' process technology, which minimizes interference by isolating each pixel from one another.
Hong Kyu-sik, Senior Vice President of Marketing at Samsung Electronics’ System LSI Business Division, stated, "Samsung Electronics will lead the market for high-definition, ultra-thin mobile devices by expanding its lineup of ultra-small pixel image sensors, starting with 16-megapixel sensors."
Samsung Electronics is leading the technological prowess in the mobile system semiconductor market by being the first in the industry to mass-produce mobile APs using the 14nm FinFET process, and by being the first in the industry to reduce pixel size to 1.0㎛ in the mobile image sensor field through its proprietary 'ISOCELL' process technology.
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