Bluetooth solution supporting government-grade 'FIPS-based' secure connections

Microchip Technology has launched ^Bluetooth® Low Energy (LE) solutions. The IS1870 and IS1871 Bluetooth LE RF ICs, certified to the latest Bluetooth 4.2 standard, expand Microchip’s existing Bluetooth portfolio alongside the BM70 module and have obtained all relevant global standards and Bluetooth Special Interest Group (SIG) certifications.

These new products are suitable for Internet of Things and Bluetooth Beacon applications, and can easily take advantage of the benefits of Bluetooth LE connectivity, such as low power consumption and simplicity.

Microchip's new Bluetooth LE device includes a certified integrated Bluetooth 4.2 firmware stack. It supports government-grade (FIPS-based) secure connections with data transfer speeds up to 2.5 times faster and enhanced connection security. Since data is transmitted and received via a Bluetooth link using Transparent UART mode, it can be easily integrated with any processor equipped with a UART interface or hundreds of ^{MicrochipPIC®} microcontrollers. The module also supports independent hostless operation for beacon applications.



The IS1870 and IS1871 ICs provide Bluetooth 4.2 performance.

The optimized power profiles of these new devices minimize current consumption to extend battery life, and they are available in an ultra-small 4x4mm form factor for RF ICs, while a 15x12mm size is supported for modules. Module options include RF standard certification as well as an uncertified (unshielded/antennaless) version for smaller remote antenna designs, which will undergo subsequent final product radiation certification.

Microchip's Bluetooth LE module includes all the hardware, software, and certifications required by designers. Developers can easily register Bluetooth SIG-certified products using Microchip's Bluetooth QDID (Qualified Design ID). Embedded Bluetooth stack profiles include proprietary services for GAP, GATT, ATT, SMP, L2CAP, as well as Transparent UART. All modules can be configured using Microchip's ^Windows® OS-based tools.

"The IS1870 and IS1871 ICs provide customers with state-of-the-art Bluetooth 4.2 performance, and the BM70 module enables customers to avoid the cost burden and risk of product delays associated with standards certification," said Sumit Mitra, Vice President at Microchip. "By offering a one-stop shopping experience that includes a proprietary Bluetooth stack, customers can not only achieve proven interoperability but also easily receive support from Microchip's global wireless experts through a single network."