Top 10 technologies selected based on issues such as intelligence, line width miniaturization, and 3D stacking.

What are the promising technologies in the semiconductor field?

Based on the issues of intelligence, line miniaturization, and 3D stacking in the semiconductor industry, we forecast ten promising technology areas. Intelligence issues related to the growing demand for semiconductors driven by the development and convergence of the IT industry include: autonomous driving system semiconductors, power semiconductors, and next-generation processor architectures like neural networking.

The issue of line width miniaturization was selected as promising fields such as △STT-MRAM △DSA process and materials △imprint blank mask/mold △dry etching equipment △dry cleaning equipment, reflecting the trend of DRAM miniaturization from 23nm to 20nm and NAND flash miniaturization from 14nm to 12nm.

In addition, in line with the issue of 3D stacking that realizes high integration through stacking, △high-selectivity hard mask process, equipment, and materials and △TSV process, equipment, and materials were also included in the well-known technologies.

The main contents of the 10 technologies selected as promising technologies are as follows.

Including autonomous driving system semiconductors, power semiconductors, etc.

System semiconductors for autonomous driving, which enable vehicles to perceive and control their surroundings without driver intervention, have seen a recent surge in patent applications. The top five applicants account for 30% of patents, demonstrating a high technological barrier. However, autonomous driving technology, based on IT and software technologies, presents significant opportunities for Korea, a leading IT powerhouse. This explains why Samsung Electronics recently officially announced its entry into the automotive electronics market. GM, Mercedes-Benz, and Toyota have already announced commercialization for 2020, and domestic automakers are also developing autonomous driving technology using imported components.

Power semiconductors play a crucial role in energy conservation in electronic devices, automobiles, and power grids. Korea has a high concentration of patent applications, and international applications are also actively being filed. The declining share of major applicants is also lowering IP barriers. Power semiconductors are also a key technology for securing the lead in next-generation growth engines such as smart devices, machine-to-machine communications, and electric vehicles.

Next-generation processor architectures, such as neuromorphic processors, process information similarly to the human brain, enabling AI to perceive, learn, and make decisions on its own. While US patent applicants account for 63% of all patent applications, indicating active technology development, the barriers to entry are high. Therefore, active government-led R&D is essential in the early stages of technology development. As the field of AI expands, the technological ripple effects are expected to be significant.

STT-MRAM is an emerging non-volatile and stable memory technology that generates electron spin by passing current through a magnetic junction tunnel, and retains data based on its resistance. Its ultra-low power and ultra-high speed capabilities make it a promising next-generation memory, succeeding DRAM. Avalanche Tech has completed development of STT-MRAM and has begun prototype production, becoming the first in the industry.

The DSA process and materials are key technologies for ultra-fine semiconductor manufacturing beyond 10nm. They utilize the self-alignment phenomenon, where a block copolymer is applied to a wafer and heated to form a fine pattern. Various technologies have recently emerged, and mass production is expected in 2017-2018. This technology can improve the cost increase caused by the increased number of processes in the currently used multi-patterning method. ASML and GlobalFoundries are actively engaged in this activity.

Imprint blank mask/mold technology is advantageous for nanopattern formation and is a mass-producible technology. It involves pressing a stamp with microstructures onto a substrate to form a pattern. While Japan holds a 64% patent share, it has recently been actively developing new technologies, including new mold and release layer manufacturing methods. Imprint lithography technology is emerging as a next-generation lithography technology through extensive R&D. Recently, R&D on improved technologies is actively underway, particularly at domestic universities and research institutes.

10 Promising Technologies in the Semiconductor Industry
-System semiconductors for autonomous driving
-Power semiconductors
-Next-generation processor architectures such as neuromorphic
-STT-MRAM
-DSA process and materials
-Imprint blank mask/mold
-Dry etching equipment
-Dry cleaning equipment
-High-selectivity hard mask process, equipment, materials and
-TSV process, equipment, materials, etc.

Dry etching equipment is a key technology for miniaturization and miniaturization, as it selectively cuts away the necessary parts according to the pattern formed on the wafer. While Japanese applicants account for 47% of this technology, Korean companies also hold a 30% share, demonstrating a gradual increase in IP competitiveness. While overseas companies like Lam Research, Applied Materials, and Tokyo Electron hold an 86% market share, domestic companies are also actively pursuing R&D to secure competitiveness.

Dry cleaning equipment utilizes dry etching technology to remove unnecessary components from the wafer surface, minimizing wastewater generation and reducing treatment costs, both of which are problems associated with wet cleaning. While this process also faces patent barriers from foreign companies, the proportion of patents held by Korean patent applicants, including Samsung, the Korea Institute of Machinery and Materials, and TES, is increasing. As the LED-related industry grows, market demand is also increasing, necessitating continued interest from domestic companies.

The technology (process, equipment, materials) for forming high-selectivity hard masks must be able to withstand the etching of multilayer insulating films as the on-stack density continues to increase, as in 3D NAND flash. A generational shift is underway from existing hard masks to new ones, and multinational companies such as AMAT have recently announced the application of new hard masks.

Finally, TSV (Through Silicon Via) process equipment and materials technology was also selected as a promising semiconductor technology. TSV connects holes in the upper and lower chips with electrodes, effectively minimizing package size and reducing power consumption. Research and development on related technologies is active, and they have recently been applied to DRAM/NAND. R&D is active at Samsung Electronics, SK Hynix, TSMC, IBM, and others.

Lee Min-young, head of the Korea Semiconductor Industry Association, said, “The reason why our country’s semiconductor industry was able to develop so rapidly was because of active investment by the government, investment by large corporations, and the production of excellent human resources. However, the industry is currently facing difficulties due to a shortage of specialized human resources caused by reduced investment by the government and large corporations and an aversion to science and engineering fields.”

The head of the headquarters continued, “Currently, the domestic semiconductor industry is facing a difficult situation both domestically and internationally due to its fragmented industrial structure, which includes memory and non-memory, large and small businesses, and a weak industrial base, as well as the fierce pursuit of China, which is shouting about IT advancement.” He added, “However, in times like these, we must secure high value-added technologies through patents and make strategic investments by identifying promising technologies that we can focus on.”