(Photo: Semicon Korea 2016 website)

Demonstration of technology with improved accuracy and sensitivity in suspended particle measurement

CyberOptics Corporation plans to present its WaferSense® and ReticleSense® Airborne Particle Sensor (APS2) technologies at the Winix booth (Hall A, No. 2228) at SEMICON Korea (www.semiconkorea.org/en), the largest microelectronics exhibition in Korea, held from January 27 to 29, 2016.

CyberOptics' APS2 improves the systematization and long-term yield of semiconductor equipment by wirelessly monitoring airborne particles in real time at semiconductor fabs. Leading the industry in accuracy and sensitivity, the next-generation APS2 further enhances the performance of CyberOptics devices, which are widely adopted by semiconductor fabs and equipment OEMs worldwide.

Ferris Chen, Sales Director for Asia at Cyber Optics, said, “The company has invested heavily in research and development (R&D) for its product portfolio to continuously develop and advance cutting-edge technologies that enable customers to save time and money.”

The wireless APS2 device enables rapid monitoring and identification of airborne particles within semiconductor process equipment and automated material handling systems, thereby allowing such particles to be reduced to 0.14 µm or less. This enables equipment and process engineers to obtain objective and reproducible data, accelerate equipment verification, shorten maintenance cycles, and lower equipment costs. Additionally, the new WaferSense APS2 has a thinner and lighter form factor, allowing it to be moved with almost any tool, making it suitable for a wider range of applications.

At the exhibition, CyberOptics also demonstrated the WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR), which measure leveling, vibration, and humidity using integrated wireless real-time devices. The thin and lightweight AMS can be moved with almost any tool, while the AMSR can capture multiple measurements at any location in a reticle environment. Using integrated devices in a semiconductor environment is another way to increase yield and reduce downtime.

WaferSense and ReticleSense Line Overview

The WaferSense measurement portfolio includes the Auto Leveling System (ALS), Auto Gapping System (AGS), Auto Vibration System (AVS), Auto Teaching System (ATS), Airborne Particle Sensor (APS), Next-Generation Airborne Particle Sensor (APS2), and the new Auto Multi Sensor (AMS), which are available in 150mm/200mm/300mm/450mm wafer sizes. The ReticleSense measurement portfolio, including the Airborne Particle Sensor (APSR & APSRQ), the next-generation APS2, the Auto Leveling System (ALSR), and the new Auto Multi Sensor (AMSR), is available in a reticle-shaped form factor.