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GCT Semiconductor Supplies 4G LTE Chips to Sprint Mobile Hotspots

Google 우선 소스Published2016.05.04 10:07
Applicable to dongles, tablets, IoT communication, home wireless routers, etc.

GCT Semiconductor, a specialist in 4G mobile communication semiconductors, announced that its 4G LTE chip GDM7243S is installed in the R850 LTE mobile hotspot, which has gone on sale at Sprint, one of the four major U.S. mobile carriers, and Boost Mobile, Sprint's prepaid service subsidiary.

Sprint's R850 mobile hotspot can provide high-speed wireless internet service via Wi-Fi to up to 10 Wi-Fi devices for several hours, whether indoors or outdoors.

GCT's GDM7243S is a chip that has been commercialized and integrated into various products by leading telecommunications carriers, including Sprint, Verizon Wireless, SKY, SK Telecom, and LG Uplus. The company stated, "This chip is designed to simplify the design of LTE communication devices and shorten time-to-market."

Alex Sum, Vice President of Sales and Marketing at GCT Semiconductor, stated, “Since the GDM7243S chip can be applied to a wide range of LTE products, from mobile hotspots, dongles, tablets, and Machine-to-Machine (M2M) communications to Cyberpiece (CPE) routers, we will further strengthen our promotional efforts for this product targeting ODMs and mobile operators worldwide.” "In particular, demand is expected to grow even more as it supports all LTE frequency bands and ideal LTE voice calls," they predicted.

The R850 mobile hotspot is being sold on the Sprint and Boost Mobile websites and their stores.
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