CV2008 series for coreless package substrates

Panasonic Corporation announced that it has commercialized a sheet-type sealant (CV2008 series) for coreless package substrates that enables the thinning and cost reduction of semiconductor packages.

This sheet-type sealant, scheduled for mass production starting in June 2016, is optimized for the insulating layer of coreless package substrates. It is also suitable for large-area sealing, contributing to package thinning and production cost reduction.


Sheet-type sealants with a uniformly formed insulating layer thickness are suitable for the latest coreless manufacturing methods as they do not require the application of laser drilling. The insulating layer for the package substrate can be formed using a large-area press process, enabling mass production of packages at a low cost.

In addition, thin sheet-type sealants possess excellent rigidity, which minimizes package bending and contributes to miniaturization. Due to the low shrinkage rate of the material, it maintains bonding stability even during high-temperature reflow processes, thereby increasing the yield of the package assembly process.