– Intersil, a global leader in the design and production of high-performance analog and mixed-signal semiconductors, announced today that it has redesigned its ISL8200MM DC/DC power module for military, harsh environments, and aviation applications.

The ISL8200MM Point Of Load (POL) DC/DC power module complies with the Defense Supply Center (DSCC) VID V62/10608 specification. This product features full military-grade electrical performance ranging from -55°C to +125°C, provides complete switch-mode power delivery within a single package, and is manufactured with tin lead finishes to ensure optimal long-term reliability. Complete traceability is provided through assembly and testing with date/trace code assignments, and Intersil offers enhanced process change notification capabilities. Combining parallel load current scalability with extended leads on a QFN package, the ISL8200MM is ideal for military communications equipment, radar, sonar, military ground vehicles, and smart processing applications.

The ISL8200MM utilizes Intersil's patented current-sharing structure to reduce PCB layout noise sensitivity when modules are used in parallel. This device integrates nearly all components required for a plug-and-play solution, replacing up to 40 parts. This high level of integration reduces the power management footprint while simplifying and accelerating the design process.

The highly thermally efficient 23-lead 15mm x 15mm QFN package features a large conductive pad on the bottom, enabling output power levels up to 60W. Internal high-power components, such as power MOSFETs and inductors, are directly connected to the conductive pad, effectively transferring heat from the module to the PCB. The thermal vias on the PCB generate a thermal resistance (Theta JA) of only 13°C/W on average. Since most heat transfer occurs through the PCB, heat dissipation through the air is generally unnecessary.

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