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ON Semi Launches Power Integrated Module Solution for Next-Generation Automotive BLDC

Google 우선 소스Published2016.07.28 11:03
Helps develop compact and stable motor drives with enhanced reliability
Highly integrated module with 30A, 40V MOSFET function


ON Semiconductor (Nasdaq: ON) has expanded its automotive Power Integrated Modules (PIMs) product family by launching the STK984-190-E.

Optimized to drive 3-phase brushless motors (BLDC) in the latest automotive models, this module includes a total of six 40V, 30A MOSFETs arranged in a 3-phase bridge, with the addition of a 40V, 30A upper reverse battery protection MOSFET. These MOSFETs are mounted on a Direct Bond Copper (DBC) substrate to create a compact module that provides excellent heat dissipation performance, reducing the board space occupied by the same components by half.

This module is suitable for driving 12V electric motors in automobiles with a power rating of up to 300W, including electric pumps, fans, and wipers. The high-efficiency BLDC solution, used with motor controllers such as the LV8907UW, incorporates an ultra-small PCB that significantly reduces both size and weight for design engineers, ensuring superior heat dissipation performance.

This module offers the effect of significantly reducing not only the number of components in the system but also the bill of materials. The DBC substrate reduces thermal resistance, thereby lowering the operating temperature of the MOSFET. This reduces power loss, which in turn minimizes temperature fluctuations caused by thermal cycling. Insulation is also improved by using a direct-bonded copper substrate. The STK984-190-E has an operating temperature of -40°C to 150°C, and all MOSFETs embedded in it meet the AEC-Q101 standards.

Chris Chey, General Manager of ON Semiconductor’s System Solutions Group, emphasized, “While developing BLDC drive solutions typically requires 13 to 15 components, the STK984-190-E automotive power module is sufficient with less than half that number of components. The module’s strong heat dissipation performance has allowed for a reduction in the size of the heatsink. With both size and weight reduced in this way, the challenges faced by engineers who had to overcome space constraints while improving fuel efficiency have been completely resolved.”
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