Low voltage operation (minimum 1.6V) and industry-leading 4 ms (max) write speed

SII Semiconductor Corporation, a subsidiary of Seiko Instruments Inc., has released new automotive 3-wire EEPROM products in an ultra-small HSNT-8 package (2030) (2.0×3.0×t0.5 mm), the S-93CxxCD0H series (105˚C) and the S-93AxxBD0A series (125˚C).

With a maximum write speed of 4ms and low voltage operation down to 1.6V, the S-93CxxCD0H series (105˚C) is capable of a wide range of applications.

As optional specifications for automotive in-vehicle electronics increase, EEPROM is being used more and more across the automotive industry. With the growing use of automotive electronics, there is a need to reduce components to save space due to limited availability. Commonly used small leadless packages consistently present issues regarding mounting strength and automated visual inspection compared to optional specifications for external lead packages.

This new product family solves these problems by introducing the HSNT-8 (2030) package, which enables easy mounting, excellent mounting strength, and visual inspection. Another key feature is that the HSNT-8 allows for drop-in replacement (same land pattern) like the commonly used leadless 8-pin DFN package.

Both models are available at various memory densities from 1K to 2K, 4K, 8K, and 16K (bits). This package option specification includes 8-pin SOP, 8-pin TSSOP, TMSOP-8, HSNT-8 (2030) (2.0×3.0×t0.5 mm), etc.

In addition, SII Semiconductor Corporation has also launched the new S-93CxxCx0I series. This product is a consumer version with an operating temperature of 85°C and targets applications such as home applications, wearable technology, and healthcare devices.